xPico IAP
Discontinued

xPico IAP is an extremely compact networking solution that enables Ethernet connectivity on virtually any device with a serial interface

Embedded Ethernet Module

  • Chip-sized Footprint: 24mm x 16.5mm
  • Complete Device Server Application with Full IP Stack
  • Modbus TCP, ASCII, RTU Support
  • Serial Port Supporting Up to 115.2kbps
  • Extended Temperature: -40° to +85° C

xPico IAP Overview

xPico IAP actual size
Designed for robust operation and with support of Modbus, the chip-sized xPico IAP module provides simplicity and flexibility making it the easiest and fastest industrial network-enabling module on the market.

xPico IAP is an extremely compact networking solution that enables Ethernet connectivity on virtually any device with a serial interface. The included industry-proven Lantronix device server application with full IP stack and Modbus Protocol support allows seamless remote access to device data, simplifying design integration while providing robust connectivity.

As the smallest embedded device server in the world, xPico IAP can be utilized in designs typically intended for chip solutions. A key difference with the xPico IAP is that there is virtually no need to write a single line of code, translating to a much lower development cost and faster time-to-market.

xPico IAP Tech Specs

Serial Interface

  • Two Serial CMOS Ports* (3.3V, 5V tolerant)
  • 300 to 115.2 kbps for Modbus enabled serial port
  • Control signals: DTR/DCD, RTS/CTS (Port 1 only)
  • Flow control XON/XOFF
  • Programmable I/O: 8 PIO pins (software selectable)
  • Lantronix Modbus application
  • Modbus TCP, Modbus ASCII, Modbus RTU. Master and Slave mode support

* Modbus can only be operated on one serial port at a time.

Network Interface

  • Interface: Ethernet 10Base-T or 100Base-TX (Auto-sensing)

Network Protocols

  • TCP/IP, UDP/IP, DHCP, ARP, ICMP, DHCP, Auto-IP, DNS, SNMPv1, TFTP, Modbus TCP, ASCII, RTU

Management and Control

  • SNMP, Telnet, Serial
  • Field upgradable firmware

Architecture

  • Based on the DSTni-EX Enhanced 16-bit x86 Architecture
  • Memory: 256KB SRAM, 512KB Flash

Included Software

Power

  • Input Voltage: 3.3VDC

Physical Interface

  • 40-pin Board-to-Board SMT Connector

Environmental

  • Operating Temp: -40° to +85° C
  • Storage Temp: -40° to +85° C
  • Relative Humidity: 0% to 90% non-condensing

Packaging

  • Dimensions: 24mm (L) x 16.5mm (W) x 5.64mm (H)
  • Weight: 2.5g

Warranty

  • 5-Year Limited
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xPico IAP

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