Open-Q™ 8250CS SOM (System on Module)

Based on Qualcomm® QCS8250 System-on-Chip with Android™ 13 OS

  • Develop with the smallest QCS8250 SOM module in world
  • Production ready

The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 provides a power platform for edge computing:

Collect – significant communications and video capture and processing capabilities
Connect – integrated WiFi 6 & BLE 5.1 in chipset
Compute – powerful CPU and GPU engines
Comprehend – neural, computer vision and DSPs
Control – many I/O interfaces to external systems to provide intelligent feedback.

The development software package supports multiple concurrent decode+encode sessions, 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs, MS Teams video extensions and other exciting camera and video features. 



NDAA Compliant

Open-Q™ 8250CS SOM (System on Module) Overview

Open-Q™ 8250CS Development Platform

The development kit for 8250CS SOM is composed of two separate items:

The Open-Q™ 865 Development Kit for 865XR/5165RB/8250CS (SOM not included)

Learn More Ordering Info

The Open-Q™ 8250CS SOM

Product Highlights

  • SOM with powerful specialized processing cores
  • On-device Qualcomm® AI Engine™ (15 TOPS) for machine vision, neural networks, deep learning workloads at low power
  • Powerful image signal processor for up to 24 video streaming cameras
  • 8K video encode/decode, up to 64MP photo and video capture
  • WiFi 6, Bluetooth Low Energy v5.1



  • Video conference systems
  • Connected camera systems
  • AI box—multi-stream encode/decode/AI processing
  • Drone vision systems
  • Machine vision platforms
  • Digital signage and kiosks
  • Retail analytics
  • Advanced high resolution multi-display systems
  • Medical imaging
  • Handheld data collectors

Key Features

  • Qualcomm® 8250CS SoC – long life IIoT chipset
  • 8GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13
  • On-device AI Engine up to 15 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
  • Ultra-compact 50 x 29 mm form factor

Open-Q™ 8250CS SOM (System on Module) Tech Specs


  • Qualcomm® QRB8250CS SoC built on 7nm technology:
    • Kryo™ 585 Octa-core CPU: 1Kryo Gold prime @ 2.84 GHz + 3 Kryo Gold @ 2.42 GHz + 4 Kryo Silver @ 1.81 GHz Hexagon™ DSP with quad Hexagon Vector eXtensions V66Q.
  • Adreno™ 650 GPU @ Fmax = 587 MHz
  • Spectra™ 480 Image Signal Processor
  • Adreno™ 665 Video Processing unit 
  • Adreno™ 995 Display Processing unit
  • NPU230 Neural Processing unit
  • SPU240 Secure Processing unit


  • 8GB LPDDR5 @ 2750MHz, 128GB UFS


  • 802.11ax 2×2 MU-MIMO + Bluetooth 5.1, Bluetooth Milan ready

Display Interfaces

  • Up to three 4K display (1 internal display through DSI and 2 external displays through DisplayPort)
  • 2x 4-lane MIPI DSI D-PHY 1.2, up to 5040 × 2160 @ 60 fps (or 120 Hz in VR mode) + touchscreen support
  • DisplayPort v1.4 on USB Type-C, at 8.1 Gbps/lane, with USB3 and USB2 data concurrency

Camera Interfaces 

  • 3x 4-lane MIPI CSI camera ports + CCI I2C control
  • Spectra 480 ISP supporting multiple concurrent cameras
  • 64 MP 30 fps ZSL with a dual ISP

Video Performance 

  • Video decode up to 4K240/8K60. Native decode support for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2, VP8, and MPEG-2 codecs
  • Video encode up to 4K120/8K30. Native encode support for H.265 Main 10, H.265 Main, H.264 High, and VP8 codecs
  • Concurrent 4K60 Dec and 4K30 Enc


  • Supports WCD938x high fidelity audio codec and WSA881x speaker amp on carrier board
  • Dedicated Hexagon™ audio DSP
  • SoundWire, MI2S, DMIC, TDM/PCM interfaces for audio devices on carrier board

High Speed Connectivity 

  • 1x PCIe Gen3 2-lane
  • 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB SS data concurrency
  • 1x USB 3.1 Type-A

Operating Environment 

  • Input voltage: 3.7V nominal
  • Operating Temperature: -25°C to +85°C Tc (component case temperature)


  • Power management and battery charging solution on SOM


Form Factor 

  • 50mm x 29mm with 2x 100-pin + 1x 120-pin board to board connectors


  • Android™ 13 — Note that all hardware features may not be supported by SW

I/O Interfaces 

  • 4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to dedicated Hexagon™ sensor DSP



Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Open-Q™ 8250CS SOM (System on Module) Downloads

Additional Product Information

Additional technical documentation and firmware information can be found at Tech Portal HERE


Learn more about this product with the Datasheet. You must log in or create a MyLantronix account to access Datasheets. 

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