Open-Q™ 660 µSOM (Micro System on Module)

Production-ready SOM based on the powerful Qualcomm® Snapdragon™ SDA660 SoC

Lantronix’s Open-Q™ 660 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® Snapdragon™ SDA660 SoC, with built-in Artificial Intelligence Engine, Spectra™ ISP, Kryo™ CPU, and Hexagon™ DSP. The feature-rich SOM will provide a leap in performance for applications requiring on-device artificial intelligence, advanced photography and image processing, or enhanced gaming.

In addition to the advanced SoC features, the SOM includes high-end Wi-Fi with 802.11ac 2×2 MU-MIMO, support for USB Type-C with 4K DisplayPort video out, a wealth of other I/O interfaces, and on-SOM power management and battery charging.

NDAA Compliant

Open-Q™ 660 µSOM (Micro System on Module) Overview

Lantronix’s Open-Q™ 660 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® Snapdragon™ SDA660 SoC, with built-in Artificial Intelligence Engine, Spectra™ ISP, Kryo™ CPU, and Hexagon™ DSP. The feature-rich SOM will provide a leap in performance for applications requiring on-device artificial intelligence, advanced photography and image processing, or enhanced gaming.

In addition to the advanced SoC features, the SOM includes high-end Wi-Fi with 802.11ac 2×2 MU-MIMO, support for USB Type-C with 4K DisplayPort video out, a wealth of other I/O interfaces, and on-SOM power management and battery charging.

Open-Q™ 660 µSOM (Micro System on Module) Tech Specs

Processor

  • Qualcomm® Snapdragon™ SDA660 built on 14nm FinFET technology
    • Qualcomm® Octa-core Kryo™ 260 CPU with:
      • 4 Kryo Gold High-performance 2.20GHz cores
      • 4 Kryo Silver low-power 1.84GHz cores
    • Qualcomm® Hexagon™ 680 DSP with Hexagon Vector eXtensions (dual-HVX512) 787 MHz
    • Qualcomm® Adreno™ 512 GPU with 64-bit addressing at 650MHz
    • OpenGL® 3.0/3.2, Vulkan® 1.1, DX12 FL 12, OpenCL™ 2.0 full profile

Memory

  • 4GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz
  • 32GB eMMC Flash in combo eMCP chip

 

 

Wireless

  • Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector
  • Bluetooth 5.x

 

LCD/touch Screen Interface

  • 2x 4-lane MIPI DSI D-PHY 1.2, up to 2560 x 1600
  • VESA DisplayPort V1.4, up to 4K30 or 2K60

Camera Interface

  • 3x 4-lane MIPI CSI combo D-PHY1.2
  • Dedicated I2C controller for each camera port
  • 2x camera flash control signals
  • Dual 14-bit Qualcomm® Spectra™ ISP: 16 +16 MP, 540 MHz each
  • 24MP30 ZSL with dual ISP; 16 MP 30 ZSL with a single ISP

Audio

  • 1x SLIMBus for external Qualcomm® Codecs
  • 1x 4-lane, 1x 2-lane MI2S interfaces for external audio devices
  • 2x digital microphone PDM interfaces
  • 1x Soundwire interface for WSA8810/WSA8815 digital speaker amps
  • Qualcomm™ Fluence™ HD (optional)

Video

  • Encode: 4K30 HEVC/H.264/VP8/MPEG4
  • Decode: 4K30 8-bit: H.264/VP8/VP9, 4K30 10-bit: HEVC
  • Concurrent: 1080p60 Decode + 1080p30 Encode

I/O Interface

  • 1x USB3.1 Gen1 Type-C, 1x USB 2.0 Host
  • 4-bit SD 3.0, 8x BLSP ports (UART, I2C, SPI), configurable GPIOs

Operating Environment

  • Input 3.6V to 4.2V
  • Operating Temperature: -25°C to +85°C Tc (component case temperature)
  • 3x 100 pin board to board connectors
  • 50mm x 25mm

Power/Battery Management

  • Power management and battery charging on SOM (PM660 and PM660L power management chips)

OS Support

  • Android™ 9

 

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Open-Q™ 660 µSOM (Micro System on Module) Downloads

Additional Product Information
Datasheet Size

Open-Q 660 µSOM HW Datasheet

Additional technical documentation and firmware information can be found at Tech Portal HERE

1.5 MB
Product Notifications

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