Open-Q™ 835 µSOM (Micro System on Module)
Last Time Buy

Powered by the top-tier Qualcomm® Snapdragon™ 835 processor

Lantronix’s Open-Q™ 835 μSOM is an ultra-compact (50mm x 25mm), production-ready SOM that is ideal for products targeting advanced 3-D graphics, lifelike VR and AR experiences, advanced machine learning technology, or the ultimate in photography and videography.

Powered by the top-tier Qualcomm® Snapdragon™ 835 processor it is built on the advanced 10nm FinFET process for smaller size and lower power. The 835 μSOM offers numerous peripheral I/O for flexible application in a wide range of advanced multimedia and IoT products.

Not recommended for new designs – contact sales for availability and recommended alternatives

NDAA Compliant

Open-Q™ 835 µSOM (Micro System on Module) Overview

The Open-Q™ 835 uSOM is intended for OEMs planning on building a commercial product needing the smallest form factor Snapdragon™ 835 SOM on the market.

Open-Q™ 835 µSOM (Micro System on Module) Tech Specs


  • Qualcomm® Snapdragon™ 835 (APQ8098) Octa-core 64 bit Kryo CPU built on 10nm technology
    • 64 bit ARM v8 compliant processor
    • 4X high-performance Kryo cores – 2.20GHz quad core, 2.30GHz single core operation
    • 4X low-power Kryo cores— 1.9 GHz
    • Qualcomm® Adreno™ 540 GPU OpenGL® ES 3.0/3.2, Vulkan® 1.1, Direct X12; OpenCL™ 2.0 full profile, RenderScript
    • Qualcomm® Hexagon™ DSP with Hexagon Vector eXtensions (dual-HVX512) designed for 900 MHz


  • Qualcomm® Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO + Bluetooth 5.0
  • 2x U.FL antenna connectors on SOM


  • 4GB LPDDR4x RAM PoP package
  • 32GB UFS2.1 Gear3 2-lane flash storage

Display Interfaces

  • 1x HDMI v2.0a 4K Ultra HD @ 60 fps video output + up to 8-channel audio for 7.1 surround sound
  • 2x 4 lane MIPI DSI DPHY 1.2 or CPHY 1.0; VESA DSC 1.1 display outputs

Camera Interfaces

  • 3x 4-lane MIPI CSI combo C/D-PHY, configurable in either 4/4/4 or 4/4/2/1
  • D-PHY: 2.5 Gbps/lane, C-PHY: ~17 Gbps (2.5 G symbols per trio per second)
  • Dual 14-bit Qualcomm® Spectra™ 180 ISP supports up to 32MP single or dual 16MP cameras

Audio Interfaces

  • 1x SLIMBUS highly multiplexed, high-speed, codec interface
  • Multi-channel configurable I2S digital audio interface – up to eight Tx/Rx channels


  • Encode: 1080p120/4K30/4x 1080p30: H.264, VP8, HEVC, MPEG-4
  • Decode: 1080p240/4K60/8x 1080p30: H.264, VP8, HEVC 8/10-bit, VP9, MPEG-4
  • Concurrent: 4K30 decode + 4K30 encode or 4K60 decode + 1080p60 encode

Sensor Core Interface

  • SPI, UART, I2C connections to sensor DSP core

General Purpose I/O


I/O Interfaces

  • 1x USB3.1 support for Type C with DisplayPort video output
  • 1x debug UART, 1x SDIO 3.0 4-bit, 1x PCIe, white LED driver interfaces

Operating Environment

  • 3x I2S
  • 1x PCM
  • 6x Analog in
  • 6x Analog out
  • 3x Digital mic

Power/Battery Management

  • Qualcomm® power management / battery charging solution

OS Support

  • Android™ 8, Android™ 9

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Open-Q™ 835 µSOM (Micro System on Module) Downloads

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Open-Q™ 835 µSOM

Open-Q™ 835 µSOM (Micro System on Module)

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