Ride SX 4.0 Automotive Development Platform
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Featuring the SA8755P and SA8255P SoCs

Develop applications today for the cars of tomorrow using the latest Qualcomm Snapdragon Ride Automotive Development Kit. The Ride SX 4.0 allows for rapid creation of customizable automotive cockpit solutions for the SA8755P or SA8255P SoCs.

The platform is designed to enable enhanced testing and debugging of the chipsets. With a backplane board connecting a combination of multiple CCAs including SoC, displays, cameras, Ethernet, PCIe, and various test cards and connectors.

NDAA Compliant

Ride SX 4.0 Automotive Development Platform Overview

Snapdragon Ride System-on-Chip Components

Major architectural blocks of both the SA8755P and SA8255P include:

  • Qualcomm Kryo Gen-6 CPU built on Arm V8.2 Cortex technology
  • Qualcomm Adreno 663 GPU for the highest in graphics performance and power efficiency as well as safe general-purpose (GP) GPU compute support
  • Qualcomm Hexagon Tensor Processor integrated with Qualcomm Hexagon DSP, quad Qualcomm Hexagon Vector eXtensions (HVX) processor, and dual Qualcomm Hexagon Matrix eXtensions (HMX) co-processors for high performance machine learning use cases.

The SA8755P Flex SoC:

The SA8755P is the next-generation Qualcomm Snapdragon Advanced Driver Assistance System (ADAS) and automotive infotainment SoC designed for superior performance and power efficiency in automotive applications. Designed with Safety Element Out of Context (SEooC), the SoC targets ASIL D use cases. Automotive Safety Integrity Level (ASIL) D is the highest rigor applied to safety assurance.

The SA8255P SoC: Automotive Infotainment

The SA8255P delivers next-generation Qualcomm Snapdragon automotive infotainment SoC designed for superior performance and power efficiency. Developed with SEooC targeting ASIL B use cases, the SAM8255P empowers automakers with scalable solutions that are connected, smart, and aware.

Ride SX 4.0 Automotive Development Platform Tech Specs

  • Ride SX 4.0 Feature Set Summary

    • Power
      • +6 VDC to +20 VDC
      • +12 VDC typical
    • SoC
      • Snapdragon Automotive SoC - available with SA8255P or SA8775P SoC
    • Memory
      • LPDDR5: 3 × 12 GB
    • Storage
      • Two 128 GB UFS 3.1
      • M.2 PCIe slot for optional NVMe SSD
      • Octal SPI NOR
    • USB
      • Two USB 3.1 type A
      • One USB 2.0 type A
    • PCIe
      • One PCIe Gen4 x2
      • One PCIe Gen4 x4
    • Cameras/video input
      • Four mini-Quad FAKRA connect
    • Displays/video output
      • Four DisplayPorts
    • Sensors
      • One sensor card: GenX connector
    • GNSS
      • Qualcomm® SiRFStar™ Location V
    • Audio
      • Seven standard I2S
      • Three high speed I2S
      • AM / FM / DAB
      • Six channel line out
      • Four analog/mic inputs
      • Two ADI A2B master nodes
    • Wired networking
      • RJ45 port connected to Safety Island Subsystem
      • RJ45 port connected to Vehicle Interface Processor (VIP)
      • Two RJ45 ports connected to SoC's SGMII ports
      • Six CAN-FD: SoC
      • Two CAN-FD: SoC – Partial Networking
      • Two CAN-FD: VIP – Partial Networking
      • Two LIN - VIP
    • Wireless Networking
      • Wi-Fi and Bluetooth: Via add-on card
    • Test and debug
      • JTAG / SWD
      • UART
      • Test automation: Embedded ALPACA PSoC
  • Qualcomm SA8775P SoC and Qualcomm SA8255P SoC

    • Processor
      • Quad Qualcomm® Kryo™ Kryo Gold Prime Cores
    • GPU
      • Qualcomm®Adreno™ 663 GPU
    • DSP
      • Qualcomm® Hexagon™ Tensor Processor integrated with Qualcomm Hexagon DSP
      • Quad Qualcomm Hexagon Vector eXtensions (HVX) processor
      • Dual Qualcomm Hexagon Matrix eXtensions (HMX) coprocessors
    • Safety Island (SAIL) Subsystem
      • Dedicated Safety Island (SAIL) Subsystem equipped with quad Cortex-R52 CPU
    • Multimedia
      • Dual Adreno DPU1199
      • Two 4-lane MIPI-DSI
      • Four embedded DisplayPort (eDP) / DisplayPort v1.4
    • Camera
      • Qualcomm Spectra 690 ISP
      • Four MIPI-CSI interfaces, configurable as D-PHY or C-PHY
    • Video
      • Adreno VPU 670 for high-quality, ultra HD video encode and decode
      • Decode up to 4 x 4k60 or 4k240; AV1, HEVC, H.264, H.265, VP9, MPEG-2
      • Encode up to 2 x 4k60 or 4k120; HEVC, H.264 and H.265
    • Memory
      • Six-channel high-speed memory - 3200 MHz LPDDR5 SDRAM (6 x 16-bit)
    • Flash
      • Via UFS: Two UFS 3.1
      • Via Octal-SPI/Quad-SPI: NOR flash (up to 166 MHz) as SAIL domain boot up device
      • Via PCIe: NVMe (non-bootable)
    • Peripherals
      • Two USB 3.1 and one USB 2.0
      • One 2-lane and one 4-lane PCIe Gen4
      • Eight SAIL domain CAN-FD interfaces
      • Two SGMII 2.5 Gbps interfaces
      • One SAIL domain RGMII interface

Ride SX 4.0 Automotive Development Platform Downloads

Lantronix Part # Name Description Order Now
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Lantronix Part #
ADP-8775-SX
Name
QAM8775P Ride 4.0 SX Automotive Development Platform
Complete Development Kit Buy Now
Lantronix Part #
ADP-8255-R
Name
QAM8255P Ride 4.0 SX Automotive Development Platform
Complete Development Kit Buy Now

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