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Unboxing The Qualcomm® Snapdragon 888 Mobile Hardware Development Kit by Lantronix

Snapdragon™ 888 Mobile Hardware Development Kit
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The Qualcomm® Snapdragon 888 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 888 Mobile Platform.

With an advanced 5-nanometer design, the Snapdragon 888 mobile platform is engineered with industry-leading innovations in AI, gaming, photography, and the many more premium experiences customers deserve. Featuring a completely rearchitected 6th gen Qualcomm® Artificial Intelligence (AI) Engine, the Snapdragon 888 delivers a total of 26 TOPS performance, 3 times performance-per-watt improvement and 16 times larger shared AI memory as compared to the previous generation.

The Qualcomm® Snapdragon 888 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 888 Mobile Platform. The Snapdragon 888 Mobile HDK is a feature-rich Android development platform that is suited for Android application developers, consumer manufacturers, hardware component vendors, camera vendors, and flash chip vendors to evaluate, optimize, test, and deploy applications that can utilize the Snapdragon 888 mobile platform technology.

The Snapdragon 888 HDK platform is designed to provide original equipment manufacturers (OEMs), hardware/software vendors, developers and engineers with next generation software technology and tools to accelerate development and testing of devices.

Check out the unboxing video HERE

Snapdragon™ 888 Mobile Hardware Development Kit Overview

Applications

Android mobile application development
Platform evaluation and benchmarking
HW component or peripheral testing
Proof of concept testing

Product Highlights

Powered by the Qualcomm® Snapdragon™ SM8350P SoC
Numerous I/O and connectivity options
Accessory peripherals available
6x 4-Lane MIPI CSI camera ports
2x 4-Lane MIPI DSI display ports
1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
Wi-Fi 6 – 802.11ax 2×2 MU-MIMO Wi-Fi / BT 5
Android™ 11

Snapdragon™ 888 Mobile Hardware Development Kit Tech Specs

Processor

Qualcomm® Snapdragon™ SM8350P – 64-bit octa-core Kryo™ 680 Processor
- New architecture based on Arm Cortex-X1 technology
- Up to 2.84 GHz
Qualcomm® Adreno™ 660 GPU
Qualcomm® Hexagon™ 780 AI Processor
Qualcomm® Spectra™ 580 Triple 14-bit Image Sensor Processor

Wireless

Qualcomm® Wi-Fi (WCN6851) 802.11a/b/g/n/ac/ax 2.4/5.0 GHz 2×2 with MU-MIMO
Bluetooth 5.0 + HS and backward compatible with 1.x, 2.x + EDR
On-board PCB trace antennas

Memory/Storage

12GB LPDDR5 RAM up to 3200 MHz
256GB UFS3.0 Flash Storage

Audio

Qualcomm® WCD9385 audio codec on-board
1x Headset headphone output
Audio Expansion Headers
- 1x loud-speaker output
- 1x Earpiece output
- 2x Analog MIC input
- 4x Digital MIC input

Video

Adreno™ VPU 665 fifth generation UHD Video Processing Unit

Display Interfaces

2x 4-Lane MIPI DSI DPHY via 2x 60-pin High Speed Display Connector
Optional Display/Expansion board mates to DSI connectors
HDMI 2.0 via DSI -> HDMI bridge chip (on-board), up to 4K @ 60Hz
DisplayPort 1.4 over USB3.1 Type-C

Camera Interfaces

4x 4-Lane MIPI CSI camera ports with separate I2C control busses (CCI0/1/2/3) on 160-pin expansion header for optional camera board
Support for 3D Camera Configuration
Additional 2x 4-Lane MIPI CSI camera ports available on high-speed expansion header

Power Input

12V/5A input from wall adapter (included), or battery (not included)

Power Management

Qualcomm® Power and battery management (PM8350, PM8350C, PM8008, PMR735A, PMR735B, PMK8350, SMB1398, SM1396, and PM8350BH)

Size

100 mm x 85 mm

OS Support

Android™ 11

I/O

1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
1x PCIe v3 2-lane to M.2 socket
1x microSD Card Socket
2x USB 3.0 Type-A host via on-board hub
1x USB micro-B debug UART
Sensor expansion headers
Low speed GPIO expansion header

Optional Accessories

Display + Expansion Board
- 6.65” AMOLED WQHD (2340 x 1080) with Touch Panel
- Additional expansion I/O: audio connectors, additional sensor connectors and JTAG connector
Rear-Facing Camera Accessory Board
- 48MP IMX586 wide-angle camera
- 16MP IMX481 ultra-wide-angle camera
- 13MP 3M5 telephoto camera
Sensor Accessory Board

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Snapdragon™ 888 Mobile Hardware Development Kit Downloads

Product Brief

Snapdragon™ 888 Mobile HDK Product Brief

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Snapdragon™ 888 Mobile Hardware Development Kit Part Numbers

Lantronix Part #	Name	Description	Order Now
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Lantronix Part # QC-DB-W00003	Name Snapdragon™ 888 Mobile Hardware Development Kit	Base Development Kit	Buy Now
Lantronix Part # QC-DB-W00005	Name Snapdragon™ 888 Mobile HDK Display + Expansion Board	Optional LCD + Expansion Board Accessory Ad-on	Contact Us
Lantronix Part # QC-DB-W00006	Name Snapdragon™ 888 Mobile HDK Rear Camera Board	Optional Rear Facing Camera Accessory Ad-on	Buy Now
Lantronix Part # QC-DB-W00007	Name Snapdragon™ 888 Mobile HDK Front Camera Board (Obsolete)	Optional Front Facing Camera Accessory Ad-on	Buy Now
Lantronix Part # QC-DB-U00007	Name Snapdragon™ 865 Mobile HDK Sensor Board	Optional Sensor Board Accessory Ad-on	Buy Now