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Snapdragon™ 888 Mobile HDK New

 

With an advanced 5-nanometer design, the Snapdragon 888 mobile platform is engineered with industry-leading innovations in AI, gaming, photography, and the many more premium experiences customers deserve. Featuring a completely rearchitected 6th gen Qualcomm® Artificial Intelligence (AI) Engine, the Snapdragon 888 delivers a total of 26 TOPS performance, 3 times performance-per-watt improvement and 16 times larger shared AI memory as compared to the previous generation.

The Qualcomm® Snapdragon 888 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 888 Mobile Platform. The Snapdragon 888 Mobile HDK is a feature-rich Android development platform that is suited for Android application developers, consumer manufacturers, hardware component vendors, camera vendors, and flash chip vendors to evaluate, optimize, test, and deploy applications that can utilize the Snapdragon 888 mobile platform technology.

The Snapdragon 888 HDK platform is designed to provide original equipment manufacturers (OEMs), hardware/software vendors, developers and engineers with next generation software technology and tools to accelerate development and testing of devices.

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Snapdragon™ 888 Mobile Hardware Development Kit New

    Overview for Snapdragon™ 888 Mobile Hardware Development Kit

    Applications

    • Android mobile application development
    • Platform evaluation and benchmarking
    • HW component or peripheral testing
    • Proof of concept testing

    Product Highlights

    • Powered by the Qualcomm® Snapdragon™ SM8350P SoC
    • Numerous I/O and connectivity options
    • Accessory peripherals available
    • 6x 4-Lane MIPI CSI camera ports
    • 2x 4-Lane MIPI DSI display ports
    • 1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
    • Wi-Fi 6 – 802.11ax 2×2 MU-MIMO Wi-Fi / BT 5
    • Android™ 11

      Features & Specifications for Snapdragon™ 888 Mobile Hardware Development Kit

      Processor

      • Qualcomm® Snapdragon™ SM8350P – 64-bit octa-core Kryo™ 680 Processor
        • New architecture based on Arm Cortex-X1 technology
        • Up to 2.84 GHz
      • Qualcomm® Adreno™ 660 GPU
      • Qualcomm® Hexagon™ 780 AI Processor
      • Qualcomm® Spectra™ 580 Triple 14-bit Image Sensor Processor

      Wireless

      • Qualcomm® Wi-Fi (WCN6851) 802.11a/b/g/n/ac/ax 2.4/5.0 GHz 2×2 with MU-MIMO
      • Bluetooth 5.0 + HS and backward compatible with 1.x, 2.x + EDR
      • On-board PCB trace antennas

      Memory/Storage

      • 12GB LPDDR5 RAM up to 3200 MHz
      • 256GB UFS3.0 Flash Storage

      Audio

      • Qualcomm® WCD9385 audio codec on-board
      • 1x Headset headphone output
      • Audio Expansion Headers
        • 1x loud-speaker output
        • 1x Earpiece output
        • 2x Analog MIC input
        • 4x Digital MIC input

      Video

      • Adreno™ VPU 665 fifth generation UHD Video Processing Unit

      Display Interfaces

      • 2x 4-Lane MIPI DSI DPHY via 2x 60-pin High Speed Display Connector
      • Optional Display/Expansion board mates to DSI connectors
      • HDMI 2.0 via DSI -> HDMI bridge chip (on-board), up to 4K @ 60Hz
      • DisplayPort 1.4 over USB3.1 Type-C

      Camera Interfaces

      • 4x 4-Lane MIPI CSI camera ports with separate I2C control busses (CCI0/1/2/3) on 160-pin expansion header for optional camera board
      • Support for 3D Camera Configuration
      • Additional 2x 4-Lane MIPI CSI camera ports available on high-speed expansion header

      Power Input

      • 12V/5A input from wall adapter (included), or battery (not included)

      Power Management

      • Qualcomm® Power and battery management (PM8350, PM8350C, PM8008, PMR735A, PMR735B, PMK8350, SMB1398, SM1396, and PM8350BH)

      Size

      • 100 mm x 85 mm

      OS Support

      • Android™ 11

      I/O

      • 1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
      • 1x PCIe v3 2-lane to M.2 socket
      • 1x microSD Card Socket
      • 2x USB 3.0 Type-A host via on-board hub
      • 1x USB micro-B debug UART
      • Sensor expansion headers
      • Low speed GPIO expansion header

      Optional Accessories

      Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

      Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

    Docs & Downloads for Snapdragon™ 888 Mobile Hardware Development Kit

    Document Size
    Snapdragon™ 888 Mobile HDK Product Brief 706 KB

    Order Information & Part Numbers for Snapdragon™ 888 Mobile Hardware Development Kit

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    QC-DB-W00003 Snapdragon™ 888 Mobile Hardware Development Kit

    Base Development Kit

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    QC-DB-W00005 Snapdragon™ 888 Mobile HDK Display + Expansion Board

    Optional LCD + Expansion Board Accessory Ad-on

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    QC-DB-W00006 Snapdragon™ 888 Mobile HDK Rear Camera Board

    Optional Rear Facing Camera Accessory Ad-on

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    QC-DB-W00007 Snapdragon™ 888 Mobile HDK Front Camera Board

    Optional Front Facing Camera Accessory Ad-on

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    QC-DB-U00007 Snapdragon™ 865 Mobile HDK Sensor Board

    Optional Sensor Board Accessory Ad-on

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    Lantronix Part # Name Description Order Now