Snapdragon™ 865 Mobile HDK
The Snapdragon 865 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 865 Mobile Platform. The Snapdragon 865 Mobile Hardware Development Kit is a feature-rich Android development platform that is designed to provide an ideal starting point for creating high-performance mobile devices and applications based on the Snapdragon 865 Mobile Platform. The kit includes the hardware, software tools and accessories needed to immediately begin your mobile development work.
- Qualcomm® Snapdragon™ SM8250 – 64-bit octa-core Kryo™ 585 Processor
- Three high-performance Gold cores at 2.42 GHz
- One high-performance Gold Prime core at 2.84 GHz
- Four low-power Kryo cores at 1.8 GHz
- Qualcomm® Adreno™ 650 GPU
- Qualcomm® Hexagon™ 698 DSP
- Qualcomm® Spectra™ 480 Image Sensor Processor
- Qualcomm® Wi-Fi (QCA6391)11a/b/g/n/ac/ax 2.4/5.0 GHz 2×2 with MU-MIMO
- Bluetooth 5.1 + HS and backward compatible with 1.x, 2.x + EDR
- On-board PCB trace antennas
- 6GB LPDDR5 PoP RAM
- 128GB UFS3.0 Flash
- Qualcomm® WCD9385 audio codec on-board
- 1x Headset headphone output
- Audio Expansion Headers
- 1x loud-speaker output
- 1x Earpiece output
- 2x Analog MIC input
- 5x Digital MIC input
- Adreno™ VPU 665 fifth generation UHD Video Processing Unit
- Video decode up to 4K240 or 8K60
- Video encode up to 4K120 or 8K30
- Concurrent 4K60 decode and 4K30 encode for wireless display
- New computer vision processor (CVP) for object detection and tracking
- 2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 2x 60-pin High Speed Display Connector
- Optional Display/Expansion board mates to DSI connectors
- HDMI 2.0 via DSI -> HDMI bridge chip (on-board), up to 4K @ 60Hz
- DisplayPort 1.4 over USB3.1 Type-C
- 4x 4-Lane MIPI CSI camera ports with separate I2C control busses (CCI0/1/2/3) on 160-pin expansion header for optional camera board
- Support for 3D Camera Configuration
- Additional 2x 4-Lane MIPI CSI camera ports available on high speed expansion header
- 12V/5A input from wall adapter (included), or battery (not included)
- Qualcomm® Power and battery management (PM8250, PM8150A, PM8150B and PM8009)
- 100 mm x 85 mm
- Android™ 10
- 1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
- 1x PCIe v3 2-lane to M.2 socket
- 1x microSD/UFS Card Socket
- 2x USB 3.0 Type-A host via on-board hub
- 1x USB micro-B debug UART
- Sensor expansion headers
- Low speed GPIO expansion header
- Camera Accessory Board
- 20MP Front Camera, 16MP+ 5MP Rear Camera, TOF Sensor
- Display + Expansion Board
- 5.99′ AMOLED WQHD (1440 x 2880) with Touch Panel
- Additional expansion I/O: audio connectors, additional sensor connectors and JTAG connector
- Sensor Accessory Board
Overview for Snapdragon™ 865 Mobile HDK
The Snapdragon 865 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 865 Mobile Platform. The Snapdragon 865 Mobile Hardware Development Kit is a feature-rich Android development platform that is designed to provide an ideal starting point for creating high-performance mobile devices and applications based on the Snapdragon 865 Mobile Platform. The kit includes the hardware, software tools and accessories needed to immediately begin your mobile development work.
With an advanced 7-nanometer design, the Snapdragon 865 platform is engineered for innovative and intelligent on-device AI, gigapixel speed professional camera quality, desktop quality graphics, and Gigabit Class download speeds. The Snapdragon 865 mobile development platform is designed to provide original equipment manufacturers (OEMs), hardware/software vendors, developers and engineers with next generation software technology and tools to accelerate development and testing of devices.
Features & Specifications for Snapdragon™ 865 Mobile HDK
Processor |
WirelessMemory/Storage |
Audio |
Video |
Display Interfaces |
Camera Interfaces |
Power Input |
Power Management |
Size |
OS Support |
I/O |
Optional Accessories |
Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.
Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.
Order Information & Part Numbers for Snapdragon™ 865 Mobile HDK
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