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Open-X™ 8M Development Kit based on the NXP® i.MX 8M™ Processor

Lantronix’s Open-X™ 8M Development Kit based on the NXP® i.MX 8M™ processor is a cost-effective, feature rich, multimedia-focused, exposed board platform powered by our Open-X™ 8M SOM (System on Module). It is ideal for evaluation of the Open-X™ 8M SOM (System on Module) as well as jump-starting development of streaming video/audio devices, voice control and general human-machine interface solutions.

With a multitude of high performance interconnect options, including two USB3.0 ports, Gigabit Ethernet, PCIe Gen2, and pre-certified dual-band 2×2 MU-MIMO WLAN, this Dev Kit is ideal for development of a wide range of embedded and IoT.

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Open-X™ 8M Development Kit

    Overview for Open-X™ 8M Development Kit

    Lantronix’s Open-X™ 8M Development Kit based on the NXP® i.MX 8M™ processor is a cost-effective, feature rich, multimedia-focused, exposed board platform powered by our Open-X™ 8M SOM (System on Module). It is ideal for evaluation of the Open-X™ 8M SOM (System on Module) as well as jump-starting development of streaming video/audio devices, voice control and general human-machine interface solutions.

    With a multitude of high performance interconnect options, including two USB3.0 ports, Gigabit Ethernet, PCIe Gen2, and pre-certified dual-band 2×2 MU-MIMO WLAN, this Dev Kit is ideal for development of a wide range of embedded and IoT.

      Features & Specifications for Open-X™ 8M Development Kit

      Processor

      • Processor
        • Quad-core ARM Cortex-A53 MPCore at 1.5 GHz + single-core ARM Cortex-M4
      • Memory/Storage
        • 3GB LPDDR4 RAM, 16GB eMMC Flash
      • Wireless
        • WLAN 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1—pre-certified module (FCC/IC)

      Display Interfaces

      • HDMI Type-A connector supporting HDMI 2.0a for 4096 x 2160 @ 60Hz
      • MIPI DSI display connector for optional LCD / Touch Panel to mount on carrier board

      Optional Accessories

      High Speed Connectivity

      • 1x USB3.0 Type-A
      • 1x USB3.0 Type-C
      • Gigabit Ethernet J45

      Audio Interfaces

      • 3.5mm line-level stereo output
      • Audio expansion:
        • 1x 16 channel bi-directional SAI digital audio interface (I2S, AC97, TDM, DSP)
        • 1x 8 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
        • 1x 2 channel receive SAI digital audio interface (I2S, AC97, TDM, DSP)
        • 1x S/PDIF input and output

      Camera

      • 2 x MIPI CSI2 camera connectors for optional camera module

      Expansion Sockets

      • M.2 socket with PCIe Gen2, USB HS, UART, I2C, I2S
      • microSD card socket

      Debug Features

      • JTAG header
      • dual debug UART (1 Cortex-A53 debug, 1 Cortex-M4 debug) on USB serial micro-B

      I/O expansion

      • I2C
      • NAND interface
      • GPIO

      Power

      • Input Power: 12V/3A to barrel jack (power supply included) or USB Type-C power
      • Power probe header for SOM power consumption measurement

      OS Support

      • Android™ 8
      • Linux®

      Form Factor

      • SOM size: 55mm x 35mm
      • Carrier Board size: Mini-ITX 170mm x 170mm with on-board mounting for optional LCD panel

      Wireless

      Two WLAN/Bluetooth PCB antennas on carrier board with coaxial connection to SOM

      Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

      Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

    Docs & Downloads for Open-X™ 8M Development Kit

    Technical Documents and Software Information

    FAQ

    Document Size
    Intelligent Edge Solution by Lantronix® Product Catalog – Letter 1 MB
    Intelligent Edge Solution by Lantronix® Product Catalog -A4 2 MB

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