Open-Q™ 605 Single Board Computer Discontinued
This Product is End of Life and is no longer available.

Intrinsyc’s Open-Q™ 605 Single Board Computer is a small, production-ready, computing platform powered by Qualcomm’s® QCS605 system-on-chip, their first built specifically for IoT devices. The QCS605 supports advanced computing at the edge with Qualcomm’s integrated AI Engine, consisting of the powerful 8-core Kryo 300 CPU, Adreno 615 GPU, Hexagon 685 DSP, and Spectra 270 ISP. The AI Engine is supported by the Qualcomm Neural Processing SDK, for advanced on-device AI, image processing, and machine learning. Built on 10nm LPP process technology, the QCS605 is engineered for exceptional power and thermal efficiency.
If you are interested in a custom designed solution based on the Qualcomm® QCS605 system-on-chip, our expert engineering services group can create a solution to meet your exact requirements.
Contact sales to discuss your specific needs today.
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Open-Q™ 605 Single Board Computer Overview
This Product is End of Life and is no longer available.
Open-Q™ 605 Single Board Computer Tech Specs
- Qualcomm® Kryo™ 300 Octa-core 64-bit ARM v-8 compliant CPU built on 10nm LPP technology, with:
- Kryo Gold: Two high-performance cores up to 2.5 GHz
- Kryo Silver: Six low-power cores up to 1.7 GHz
- Qualcomm® Hexagon™ 685 DSP + Adreno™ 615 GPU supporting artificial intelligence and machine learning
- Non-PoP, combo eMCP chip with 4GB LPDDR4X SDRAM and 32GB eMMC Flash storage
- Wi-Fi 802.11b/g/n/ac 2×2 MIMO (WCN3990 ) + Bluetooth 5.x, U.FL antenna connectors
- 2x 4-lane MIPI CSI to micro camera module connectors
- 2x Qualcomm® Spectra™ 270 14-bit image signal processors
- 4-lane MIPI DSI + I2C touch interface on flex cable connector to support optional LCD panel up to 1080p at 30fps
- DisplayPort 1.4 via USB Type-C up to 4K at 30fps with USB data concurrency
- Qualcomm® GNSS receiver (SDR660G), Integrated Qualcomm® Location Suite Gen9 VT, U.FL antenna connector
- Integrated audio codec with speaker amp provides 2x analog mic I/Ps, 1x speaker O/P, headset I/O
- I2S/SLIMBus digital audio interface + 2x DMIC ports on expansion header for other audio I/O options
- USB3.1 Type-C interface with DisplayPort video output and Quick-Charge capability
- Micro SD card socket for additional, removable storage.
- 76 Pin header with:
- Multiple SPI, I2C, UART, GPIO, and sensor I/O interfaces
- Digital and analog audio I/O, LED flash O/P, haptic O/P, power output rails
- Qualcomm® power management system (PM670 + PM670L) provides power, clocks, housekeeping, battery charging and fuel gauge, integrated audio codec
- Three buttons and three LEDs for user control and status indication
- 5V -> 15V DC external power or single-cell Lithium Ion battery (not included), charged by USB Type-C
- Android™ 9
- 50mm x 68mm x 13mm, with four mounting holes, panel-ready power jack, μSD socket and USB Type-C
- 50mm x 68mm x 13mm, with four mounting holes, panel-ready power jack, μSD socket and USB Type-C
- FCC/IC/CE pre-certified Wi-Fi/BT (planned), ROHS/REACH compliant (planned)
Processor |
Memory/StorageWireless |
Camera Interfaces |
Embedded Display |
External Display |
Location GNSS |
Audio |
USB Interface |
Micro SD Card |
Expansion Head |
Power Management |
Optional AccessoriesOpen-Q™ IMX258 Camera Module |
User Interface |
Power Input |
OS Support |
OS Support |
Operating Temp |
Certifications |
Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.
Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.