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Featured Products

New intrinsyc lantronix open q-610 micro som devkit front
Open-Q™ 610 µSOM Development Kit

-Powered by ultra-compact (50x25mm) Open-Q 610 µSOM
-Open-frame Mini-ITX Form-factor carrier board for evaluation and development
-Ethernet, 2x USB, µSD socket, GPIO, sensor board
-Optional LCD/touchscreen and cameras
-Wi-Fi / Bluetooth antenna on carrier board
-Yocto Linux™

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New Open-Q 2200
Open-Q™ 2200 Series SIP

Based on the Qualcomm® QCS2290 (Android) & QRB2210 (Yocto Linux) processors with:
On-board audio codec
2GB of LPPDR4 memory
16GB of eMMC
Pre-certified Wi-Fi and Bluetooth

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New 4200
Open-Q™ 4200 Series SIP

Compact SIP with Qualcomm QCS4290 (Android) & QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
3rd generation Qualcomm AI Engine
Vivid graphics with Qualcomm Adreno 610 GPU
Multiple high speed connectivity options
Up to 6GB LPDDR4 and 256GB eMMC
Long term support with extended life hardware and software support through 2027

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New orig 865 now upd'd type to 8250CS -1221m
Open-Q™ 8250CS SOM (System on Module)

SOM with powerful specialized processing cores
On-device Qualcomm® AI Engine™ (15 TOPS) for machine vision, neural networks, deep learning workloads at low power
Powerful image signal processor for up to 24 video streaming cameras
8K video encode/decode, up to 64MP photo and video capture
WiFi 6, Bluetooth Low Energy v5.1

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New Lantronix-RB-Series-Dev-Kit
Open-Q™ AL Development Kit

The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.

The development kit is compatible with the Open-Q™ 4290 and 2290 SIPs. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.

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New Lantronix-RB-Series-Dev-Kit
Open-Q™ RB Development Kit

The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.

The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.

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Products

Open-Q™ 9100IQ & 9075IQ SiP (System in Package)

Qualcomm® Kryo™Gen 6 octal-core CPU and Adreno™ 663 GPU
On-device Qualcomm® AI Engine™ (100 TOPS) for machine vision, neural networks, deep learning workloads at low power
Image signal processor supporting up to 16 concurrent video streaming cameras
Extended operating temperature range from -40°C to 115°C junction temperature

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Open-Q™ 2500 Development Kit

Powered by the Open-Q™ 2500 SOM (System on Module)
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Carrier board 170mm x 170mm,SOM 31.5mm x 15mm
Optimized Android™ for Wearables

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Open-Q™ 2500 SOM (System on Module)

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 2500 processor
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Dimensions 15mm x 31.5mm
Android™ 8 Oreo™ for Wearables

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Open-Q™ 5165RB SOM

SOM with powerful specialized processing cores
On-device Qualcomm® AI Engine™ for machine vision, neural networks, deep learning
Power-efficient edge AI computing solution pushing 15 TOPS
Ubuntu 20.04 Linux with support for Robot Operating System 2.0
Container and accelerator APIs - Docker, TensorFlow Lite, NNAPI and others

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Open-Q™ 626 µSOM (Micro System on Module)

Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 626 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 25mm x 50mm
Android™ 9, Android™ 10,  Yocto Linux®

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Open-Q™ 626 µSOM Development Kit

Powered by the Open-Q™ 626 µSOM (Micro System on Module)
Octa-Core 64-bit ARM® Cortex™ A53 2.2GHz CPU (APQ 8053Pro)
Carrier board 170mm x 170mm
Android™ 9, Android™ 10,  Yocto Linux®

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Open-Q™ 660 µSOM Development Kit

Powered by the Open-Q™ 660 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 260 CPU, Adreno™ 512 GPU & Hexagon™ 680 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie

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Open-Q™ 845 µSOM (Micro System on Module)

- Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 845 processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP with dual HVX51
- Dimensions 25mm x 50mm
- Android™ 9, Android™ 10, Yocto Linux®

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Open-Q™ 845 µSOM Development Kit

Powered by the Open-Q™ 845 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie, Android™ 10, Yocto Linux®

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Open-Q™ 865XR SOM

- Production-ready SOM based on the powerful Qualcomm® SXR2130P
- Qualcomm® SXR2130P SoC built on 7nm technology
- Dimensions: 50mm x 29mm
- Android™ 10

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Last Time Buy 835uSOM-Devkit-LCD-Front_cb8ae4c3-ae83-4dac-b83e-8203ff7ad5b9_2048x2048
Open-Q 835 µSOM Development Kit

Powered by the Open-Q™ 835 µSOM (Micro System on Module).
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with Dual HVX
Carrier board Mini-ITX 170mm x 170mm
Android™ 8 Oreo™, Android™ 9 Pie

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Last Time Buy 410V2-FrontLCD-NoShadow
Open-Q™ 410 Development Kit

Powered by the Open-Q™ 410 SOM (System on Module)
Quad-core 64-bit ARM® Cortex® A53, Adreno™ 306 GPU, Hexagon™ v5 DSP
Carrier board 130mm X 130mm, SOM 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Windows™ 10 IoT Core, Linux®

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Last Time Buy Open-Q™ 410 System on Module
Open-Q™ 410 SOM (System on Module)

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 410 processor
Quad-core 64-bit ARM® Cortex®, Adreno™ 306 GPU & Hexagon™ v5 DSP
Dimensions 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Linux®

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Last Time Buy 624A-SOM-FRONT (1)
Open-Q™ 624A SOM (System on Module)

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 624 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 46.5mm x 50mm
Android™ 8 Oreo™

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Last Time Buy 820pro dev kit
Open-Q™ 820 µSOM Development Kit

Powered by the Open-Q™ 820 µSOM (Micro System on Module)
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux®, Android™ 9 Pie
See the Open-Q™ 820 SOM vs. Open-Q™ 820 µSOM selection guide here

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Last Time Buy 820pro dev kit
Open-Q™ 820Pro µSOM Development Kit

Powered by the Open-Q™ 820Pro µSOM (Micro System on Module)
Long-life, higher-speed, Qualcomm® Snapdragon™ 820E (APQ8096SG) SoC
Quad-core 64-bit Kryo™ CPU @ 2.342 GHz, Adreno™ 530 GPU @ 652.8 MHz, Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 9 Pie, Debian Linux®

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Last Time Buy Open-Q™ 835 µSOM
Open-Q™ 835 µSOM (Micro System on Module)

Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 835 processor
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with dual HVX
Dimensions 25mm x 50mm
Android™ 8 Oreo™, Android™ 9 Pie

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Last Time Buy 845-LCD-Front_ad23a87f-7814-4509-a394-944bbb1e2117_2048x2048
Snapdragon™ 845 Mobile HDK

- Powered by the Qualcomm® Snapdragon™ 845 Processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
- Mini-ITX form-factor — 170mm x 170mm
- Android™ 9 Pie

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