New

Open-Q™ 6490CS SOM (System on Module)

Based on Qualcomm® Dragonwing QCS6490 System-on-Chip

Optimized Processor for Compute Intensive Cameras

The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as smart cameras, video collaboration, industrial handhelds, and video telematics. Based on the Qualcomm® Dragonwing™ QCS6490 SoC, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.

Product Brief

Overview

With the release of the pin-compatible Open-Q 5430CS and Open-Q 6490CS, Lantronix offers our customers product choices that allow them to scale their product line with less investment and shorter time to market.

Lantronix offers TAA and NDAA compliant products with at least 10 years of longevity for the Open-Q 5430CS, Open-Q 6490CS, Open-Q 5165RB, Open-Q 8250CS, and Open-Q 8550CS with strict Bill-of-Material and quality control. Combined with over 20 years of hardware design and software development experience, and 1200+ successful projects, Lantronix will be your long-term partner, ensuring the ongoing success of your product journey.

Features

Qualcomm® Dragonwing™ QCS6490 SoC
Up to 16GB LPDDR5 RAM + 64GB eMMC
Support UFS and NVMe storage
Android™ 13 and Qualcomm Linux
On-device AI Engine up to 12.5 TOPS
Dedicated Computer Vision Engine
Multiple MIPI camera and display ports
Multiple high speed connectivity options
Ultra-compact 47 x 35 mm form factor

Focus Applications

IP Cameras

Multi-camera and smart camera systems

Video telematics

Video conferencing

Retail self-check-out

Digital signage

Drones

Rugged Handhelds

Engineering Services

Lantronix leverages our unparalleled engineering expertise and product development best practices to deliver high quality, innovative products, cost-effectively, and on time.

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Specifications

Processors
- Qualcomm® Dragonwing™ QCS6490 SoC built on 6nm technology:
  - Kryo™ 670 Octa-core CPU: 1 Prime @ 2.7 GHz + 3 Gold @ 2.4 GHz + 4 Silver @ 1.8 GHz
  - Hexagon™ 770 with Hexagon Vector eXtensions (HVX)
- Adreno™ 643L GPU @ Fmax Spectra™
- Spectra™ 570L ISP
- Adreno™ 633 video processing unit
- Adreno™ 1075 display processing unit
- 6th Gen Qualcomm AI Engine
- Secure processing unit
Memory/Storage
- Up to 16GB LPDDR5 and 64GB eMMC configuration (other configurations available upon request)
- Supports external UFS and NVMe storages
Wireless
- Supports external Wi-Fi via PCIe 1-lane, up to Wi-Fi 6E, 2×2 MU-MIMO + Bluetooth 5.2
Display Interfaces
- 1x 4-lane MIPI DSI D-PHY 1.2, up to FHD+ touchscreen support
- Support for USB3.1 Type-C with DisplayPort v1.4 and USB 2.0
- Embedded DisplayPort (eDP)
Camera Interfaces
- 5x 4-lane MIPI CSI D-PHY 1.2 or C-PHY 1.2 with CCI I2C control
- Spectra 570L ISP supporting 36 MP + 22 MP at 30 fps or three 22 MP at 30fps ZSL.
- 3x IFE, 2x IFE-lite, 5 concurrent MIPI CSI configurable in 4 + 4 + 4 + 4 + 4 configuration
Video Performance
- Decode
  - Video decode up to 4K60. Native decode for H.265/H.265/VP9
- Encode
  - Video encode up to 4K30. Native encode for H.265/H.265; Support for HDR10 and HDR10+ playback
- Decode & Encode
  - Concurrent 1080p60 Decode and 1080p60 Encode or 4K30 Decode and 4K30 Encode
Audio
- Support interfaces to WCD938x/WCD937x high fidelity audio codec and WSA883x speaker amp on carrier board.
- Hexagon™ audio DSP V66M
High Speed Connectivity
- 1x PCIe Gen3 2-lane; 1x PCIe Gen3 1-lane for connectivity
- 1x USB 3.1 with support for Type-C + DisplayPort v1.4 with USB SS data concurrency
- 1x USB 2.0
I/O Interfaces
- 4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to dedicated Hexagon™ sensor DSP
Power/Battery
- Power management on SOM
Operating Environment
- Input voltage
  - 3.8V nominal
- Operating Temperature
  - commercial and industrial temperatures available
Form Factor
- 47 x 35 x 2.72 mm LGA
Software
- OS Support
  - Android™ 13 and Qualcomm Linux

*QCS6490 Chipset Performance, see SOM/SIP Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Open-Q is a trademark of Lantronix, Inc. Qualcomm and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated. Qualcomm QCS6490, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Spectra and Qualcomm AI Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Adreno, Hexagon, Kryo and Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Part Numbers

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Part Number	Name	Description
QC-SIP-6490CS-A	Open-Q 6490CS SOM	4GB LPDDR5 / 32GB eMMC	Buy Now
QC-SIP-6490CS-C	Open-Q 6490CS SOM	8GB LPDDR5 / 64GB eMMC	Buy Now
QC-SIP-6490CS-D	Open-Q 6490CS SOM	16GB LPDDR5 / 64GB eMMC	Buy Now

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Open-Q™ 6490CS SOM (System on Module)

Optimized Processor for Compute Intensive Cameras

Features

Processors

Memory/Storage

Wireless

Display Interfaces

Camera Interfaces

Video Performance

Audio

High Speed Connectivity

I/O Interfaces

Power/Battery

Operating Environment

Form Factor

Software

Empowering Your development

Services

Services

Industries

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Industries

Software

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