New

Open-Q™ 6490CS SOM (System on Module)

Based on Qualcomm® Dragonwing QCS6490 System-on-Chip

Optimized Processor for Compute Intensive Cameras

The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as smart cameras, video collaboration, industrial handhelds, and video telematics. Based on the Qualcomm® Dragonwing™ QCS6490 SoC, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.

Product Brief Buy Now

12.5 TOPS Edge AI

Deliver powerful on-device AI performance for demanding edge intelligence applications.

Dedicated Computer Vision Engine

Accelerates vision workloads for demanding image-processing applications.

Ultra-Compact Design

A 47 × 35 mm form factor brings high-performance computing into space-constrained products.

Long-Term Product Availability

At least 10 years of product longevity helps support products designed for extended deployment.

Overview

Open-Q™ 6490CS: High-Performance AI for Intelligent Edge Products

The Open-Q™ 6490CS is a production-ready computing module built around the Qualcomm® Dragonwing™ QCS6490 SoC, combining powerful computing, AI, vision, graphics, and multimedia capabilities in a compact package. It provides a flexible foundation for products such as smart cameras, video telematics, retail systems, industrial devices, and other intelligent edge applications.

Features

Qualcomm® Dragonwing™ QCS6490 SoC
Up to 16GB LPDDR5 RAM + 64GB eMMC
Support UFS and NVMe storage
Android™ 13 and Qualcomm Linux
On-device AI Engine up to 12.5 TOPS
Dedicated Computer Vision Engine
Multiple MIPI camera and display ports
Multiple high speed connectivity options
Ultra-compact 47 x 35 mm form factor

From Development to Production

Lantronix combines Qualcomm® expertise with hardware, software, and product development services to help customers accelerate development and bring intelligent edge products to market.

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SOLUTION FEATURES

Smart Camera Applications

Build intelligent cameras with advanced image processing and multi-camera support.

Video Collaboration

Support up to five cameras with advanced ISP capabilities for multi-camera and 360° vision applications.

Intelligent Retail

Enable AI-powered self-checkout, digital signage, and customer-facing edge applications.

Connected Mobile Systems

Power video telematics, drones, and rugged handhelds with efficient edge computing.

Engineering Services

Lantronix leverages our unparalleled engineering expertise and product development best practices to deliver high quality, innovative products, cost-effectively, and on time.

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Focus Applications

IP Cameras

Enable intelligent video capture, processing, and real-time analytics at the edge.

Multi-camera and smart camera systems

Power advanced multi-camera systems with AI-driven vision and image processing.

Video telematics and Video conferencing

Deliver real-time video processing for connected transportation, fleet monitoring, and video collaboration.

Retail self-check-out

Enable responsive, AI-powered checkout and customer interaction experiences.

Digital signage

Drive rich, interactive digital content with advanced multimedia processing.

Drones

Support intelligent aerial imaging, video processing, and autonomous edge applications.

Rugged Handhelds

Provide portable computing for demanding field, industrial, and mobile applications.

Specifications

Processors
- Qualcomm® Dragonwing™ QCS6490 SoC built on 6nm technology:
  - Kryo™ 670 Octa-core CPU: 1 Prime @ 2.7 GHz + 3 Gold @ 2.4 GHz + 4 Silver @ 1.8 GHz
  - Hexagon™ 770 with Hexagon Vector eXtensions (HVX)
- Adreno™ 643L GPU @ Fmax Spectra™
- Spectra™ 570L ISP
- Adreno™ 633 video processing unit
- Adreno™ 1075 display processing unit
- 6th Gen Qualcomm AI Engine
- Secure processing unit
Memory/Storage
- Up to 16GB LPDDR5 and 64GB eMMC configuration (other configurations available upon request)
- Supports external UFS and NVMe storages
Wireless
- Supports external Wi-Fi via PCIe 1-lane, up to Wi-Fi 6E, 2×2 MU-MIMO + Bluetooth 5.2
Display Interfaces
- 1x 4-lane MIPI DSI D-PHY 1.2, up to FHD+ touchscreen support
- Support for USB3.1 Type-C with DisplayPort v1.4 and USB 2.0
- Embedded DisplayPort (eDP)
Camera Interfaces
- 5x 4-lane MIPI CSI D-PHY 1.2 or C-PHY 1.2 with CCI I2C control
- Spectra 570L ISP supporting 36 MP + 22 MP at 30 fps or three 22 MP at 30fps ZSL.
- 3x IFE, 2x IFE-lite, 5 concurrent MIPI CSI configurable in 4 + 4 + 4 + 4 + 4 configuration
Video Performance
- Decode
  - Video decode up to 4K60. Native decode for H.265/H.265/VP9
- Encode
  - Video encode up to 4K30. Native encode for H.265/H.265; Support for HDR10 and HDR10+ playback
- Decode & Encode
  - Concurrent 1080p60 Decode and 1080p60 Encode or 4K30 Decode and 4K30 Encode
Audio
- Support interfaces to WCD938x/WCD937x high fidelity audio codec and WSA883x speaker amp on carrier board.
- Hexagon™ audio DSP V66M
High Speed Connectivity
- 1x PCIe Gen3 2-lane; 1x PCIe Gen3 1-lane for connectivity
- 1x USB 3.1 with support for Type-C + DisplayPort v1.4 with USB SS data concurrency
- 1x USB 2.0
I/O Interfaces
- 4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to dedicated Hexagon™ sensor DSP
Power/Battery
- Power management on SOM
Operating Environment
- Input voltage
  - 3.8V nominal
- Operating Temperature
  - commercial and industrial temperatures available
Form Factor
- 47 x 35 x 2.72 mm LGA
Software
- OS Support
  - Android™ 13 and Qualcomm Linux

*QCS6490 Chipset Performance, see SOM/SIP Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Open-Q is a trademark of Lantronix, Inc. Qualcomm and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated. Qualcomm QCS6490, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Spectra and Qualcomm AI Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Adreno, Hexagon, Kryo and Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Resources

Product Brief

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Open-Q™ 6490CS SOM Product Brief (A4)

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Open-Q™ 6490CS SOM Product Brief (US)

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Environmental Certs RoHS and REACH_Open-Q™ 6490CS SOM

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Additional technical documentation and firmware information can be found at Tech Portal HERE

Part Numbers

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Part Number	Name	Description
QC-SIP-6490CS-A	Open-Q 6490CS SOM	4GB LPDDR5 / 32GB eMMC	Buy Now
QC-SIP-6490CS-C	Open-Q 6490CS SOM	8GB LPDDR5 / 64GB eMMC	Buy Now
QC-SIP-6490CS-D	Open-Q 6490CS SOM	16GB LPDDR5 / 64GB eMMC	Buy Now

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Open-Q™ 6490CS SOM (System on Module)

Optimized Processor for Compute Intensive Cameras

Open-Q™ 6490CS: High-Performance AI for Intelligent Edge Products

Features

From Development to Production

Processors

Memory/Storage

Wireless

Display Interfaces

Camera Interfaces

Video Performance

Audio

High Speed Connectivity

I/O Interfaces

Power/Battery

Operating Environment

Form Factor

Software

Empowering Your development

Services

Services

Industries

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