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Open-Q™ 615IQ Development Kit

Supporting the Open-Q™ 615IQ System on Module (SOM)
NDAA CompliantTAA Compliant
Overview

The Open-Q™ 615IQ Development Kit is engineered to support evaluation and prototyping with Lantronix’s new industrial SMARC System on Module (SOM) product line. Built around the Qualcomm IQ-615 chipset, this kit highlights key features such as MIPI CSI camera, display, Ethernet, audio, and sensor interfaces. Its SMARC standard form factor makes it ideal for proof-of-concept applications in industrial robotics and control systems. The kit also serves as a reference design, showcasing the unique camera and audio interface capabilities of the SOM.

Features

  • Qualcomm® IQ615 SoC

  • Up to 8GB LPDDR4x RAM

  • Up to 128GB UFS with SDIO storage support

  • Support SMARC 2.2 SOM

  • Qualcomm Linux

  • Industrial temperature availability

  • Support up to Wi-Fi 6/BT 5.2

  • Customizable memory and storage options

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Specifications
  • Open-Q™ 615IQ SOM

    • Processors
      • Qualcomm® IQ-615 SoC:
      • Qualcomm® Kryo™ 460: 2x Gold @ 1.9GHz, 6x Silver @ 1.6GHz
      • Qualcomm® Hexagon™
      • Qualcomm® Adreno™ 612 GPU
      • Qualcomm® Spectra™ ISP
      • Qualcomm® Adreno™ Display Processing unit
      • Trust Zone, Cryptographic Accelerator
    • Memory/Storage
      • Up to 8GB LPDDR4x DRAM, 2.133GHz, up to 128GB UFS with SDIO storage support
    • Wireless
      • Pre-certified Wi-Fi/BT, support up to Wi-Fi 6 and Bluetooth 5.2
  • Open-Q™ 615IQ SOM Carrier Board

    • Display Interfaces
      • DisplayPort v1.4
      • LVDS Connectors; Supporting LVDS panels up to 1920 × 1080p at 60 fps)
    • Camera Interfaces
      • 1x MIPI 2-lane CSI D-PHY 1.2 with CCI I2C control
      • 1x MIPI 4-lane CSI D-PHY 1.2 with CCI I2C control
      • Compatible camera module: Lantronix IMX258 13MP (QC-DB-U10006)
    • Audio Interfaces
      • RCA 2 Channel Audio input
      • RCA 2 Channel Audio output
      • TRS connector Audio input
      • DMIC
    • I/O Interfaces
      • 4× USB 2.0 ports, 1× USB 3.1 Type-C port
      • Micro USB debug UART and serial debug UART connectors
      • MicroSD socket
      • GPIO, I²C, UART, CAN, and JTAG interfaces
      • Digital I/O expansion headers
      • M.2 M-Key connector for PCIe: 1-lane for IQ-615, 4-lane to SOM connector
      • 2× Gigabit Ethernet interfaces: IQ-615: Ethernet 1 = RGMII, Ethernet 2 = N/A
    • Power
      • 12V input
    • Form Factor
      • 200mm x 170mm
    • OS Support
      • Yocto Linux

*IQ-615 Chipset Performance, see SOM/SIP Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Open-Q is a trademark of Lantronix, Inc. Qualcomm and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated. Qualcomm QCS6490, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Spectra and Qualcomm AI Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Adreno, Hexagon, Kryo and Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Part Numbers
Part Number Name Description
LOQ-615IQ-EVK Open-Q™ 615IQ Development Kit Open-Q™ 615IQ devkit bundle with 8GB/64GB SOM and accessories Contact Us
Related Products
Coming Soon!
Based on Qualcomm® Dragonwing™ IQ-615 System-on-Chip
Resources
Product Brief
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Open-Q 615IQ Dev Kit Product Brief
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Additional technical documentation and firmware information can be found at Tech Portal HERE

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Lantronix Centralized Management Software

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Resources

From training , to white papers, videos, and more, you’ll find what you need to design, develop, deploy and manage powerful, innovative remote networking and IT infrastructure management applications and solutions.

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