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Open-Q™ 8550CS SOM (System on Module)

Based on Qualcomm® Dragonwing™ QCS8550 System-on-Chip

Ideal for Advanced Video and AI Applications

The Open-Q™ 8550CS offers a premium performance level of 48 INT8, 12 FP16 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on Qualcomm’s Dragonwing™ QCS8550, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, maximum heterogeneous computing, an 8th-generation AI Engine delivering 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.

Product Brief

Overview

Lantronix offers TAA and NDAA compliant products with at least 10 years of longevity for the Open-Q 5430CS, Open-Q 6490CS, Open-Q 5165RB, Open-Q 8250CS, and Open-Q 8550CS with strict Bill-of-Material and quality control. Combined with over 20 years of hardware design and software development experience, and 1200+ successful projects, Lantronix will be your long-term partner, ensuring the ongoing success of your product journey.

Key Features

Qualcomm® 8550 SoC
Android™ 13 and Linux Yocto Kirkstone
On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
Dedicated Computer Vision Engine
Multiple MIPI camera and display ports
Multiple high speed connectivity options

Blue UAS Companion Computer SOM Listing

DCMA-vetted and NDAA-compliant, the Open-Q 8550CS SOM lets drone OEMs skip months of compliance and validation work and build on a compute platform already cleared for U.S. defense and government programs

Lantronix Open-Q™ 8550CS System-on-Module (SOM) has been added to the Blue UAS Framework, the U.S. Department of War’s (DoW) list of vetted, NDAA-compliant components for unmanned aircraft systems (UAS), giving drone OEMs a high-performance AI compute module already cleared for U.S. defense programs.

Learn More about Blue UAS

Applications

Multi-camera and smart camera systems

Edge AI gateways

Video collaboration

Retail

Cloud Gaming

Industrial drones

Autonomous mobile robots

Engineering Services

Lantronix leverages our unparalleled engineering expertise and product development best practices to deliver high quality, innovative products, cost-effectively, and on time.

Learn More

Specifications

Processors
- Qualcomm® 8550CS SoC built on 4nm technology:
  - Kryo™ Octa-core CPU: 1 Prime @ 3.2 GHz + 4 Gold @ 2.8 GHz + 3 Silver @ 2.0 GHz
- Adreno™ 740 GPU
- Spectra™ Image signal processor
- Adreno™ 8550 video processing unit
- Adreno™ 1295 display processing unit
- Dual eNPU V3, 4x HVX, HMX, 48 INT8, 12 FP16 TOPs
- Secure processing unit
Memory/Storage
- 8GB LPDDR5x @ 4200MHz, and 128GB UFS, 16GB LPDDR5x @ 4200MHz and 128GB UFS, or 8GB LPDDR5x @ 4200MHz and 1TB UFS
Wireless
- Wi-Fi 7 802.11be 2×2 MU-MIMO + Bluetooth 5.3 capable
Display Interfaces
- Up to four concurrent displays. Up to QHD+ @ 144Hz on-device display, up to 4K@60 Hz external display
- 2x 4-lane MIPI DSI D-PHY 1.2
- Support DisplayPort v1.4 on USB Type-C with USB3.1 Gen 2
Camera Interfaces
- 8x MIPI CSI D-PHY 1.2 or C-PHY 2.0 camera ports + CCI
- I2C control
- Up to five concurrent cameras, 18bpp, 64 + 36 MP30, or 3x 36 MP30, or 1x 108 MP 30 fps ZSL, 3IFE + 2 IFE Lite, Always-on camera
Video Performance
- Decode
  - Video decode up to 4K240/8K60. Native decode support for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2
- Encode
  - Video encode up to 4K120/8K30. Native encode support for H.265 Main 10, H.265 Main, H.264 High
- Decode & Encode
  - Concurrent 4K60 Dec and 4K60 Enc
Audio
- Supports WCD938x high fidelity audio codec and WSA884x speaker amp on carrier board.
- Dedicated Hexagon™ audio DSP, SoundWire, MI2S, DMIC interfaces for audio devices on carrier board
High Speed Connectivity
- 2x PCIe Gen3 2-lane
- Support SGMII and USXGMII interfaces
- 1x USB 3.1 Gen 2 with support for Type-C + DisplayPort v1.4
- 1x USB 3.1 Gen 1
I/O Interfaces
- 2x SDC v 3.0, 1x SD, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to Qualcomm Sensing Hub 3.0
Power/Battery
- Power management and battery charging solution on SOM
Operating Environment
- Input voltage
  - 3.7V nominal
- Operating Temperature
  - -25°C to +85°C
Form Factor
- 54 x 45 x 3.61 mm LGA SOM
OS Support
- Android™ 13 and Linux Yocto Kirkstone

* QCS8550 Chipset Performance, see SOM Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Open-Q is a trademark of Lantronix, Inc. Qualcomm and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated. Qualcomm QCS8550, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Spectra and Qualcomm AI Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Adreno, Hexagon, Kryo and Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Resources

Product Brief

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Open-Q-8550CS SOM Product Brief (US)

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Open-Q-8550CS SOM Product Brief (A4)

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Certificates

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Environmental Certs RoHS and REACH_Open-Q™ 8550CS SOM

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CERT, Open-Q 8550CS SOM DSS

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CERT, Open-Q 8550CS SOM DTS

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CERT, Open-Q 8550CS SOM NII

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CERT, Open-Q 8550CS SOM 6XD

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CERT, CE DOC, Open-Q 8550CS SOM

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CERT, ISED, Open-Q 8550CS SOM

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CERT, EU, Open-Q 8550CS SOM

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Additional technical documentation and firmware information can be found at Tech Portal HERE

Part Numbers

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Part Number	Name	Description
QC-SIP-8550W-A	Open-Q 8550CS SOM	8GB LPDDR5x, 128GB UFS, Wi-Fi/BT, SOM	Buy Now
QC-SIP-8550W-B	Open-Q 8550CS SOM	16GB LPDDR5x, 128GB UFS, Wi-Fi/BT, SOM	Buy Now
QC-SIP-8550W-C	Open-Q 8550CS SOM	8GB LPDDR5X, 1TB UFS, WiFI/BT, SOM	Buy Now

Case Study

Lantronix Powers Next-Gen Drone OEM Innovation with Edge AI in Collaboration with Teledyne FLIR OEM & Gremsy

Lantronix provides drone OEMs with high-performance Open-Q™ System on Module (SOM) solutions, featuring Qualcomm® processors to enable advanced onboard Edge AI and autonomous navigation. By delivering TAA- and NDAA-compliant technology, Lantronix helps manufacturers accelerate the development of next-generation UAVs that offer extended flight times, real-time data processing, and superior mission reliability.
Learn More

Empowering Your development

Bring the power of Lantronix Engineering Services with SOMs to speed up and elevate your development.

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Open-Q™ 8550CS SOM (System on Module)

Ideal for Advanced Video and AI Applications

Blue UAS Companion Computer SOM Listing

Processors

Memory/Storage

Wireless

Display Interfaces

Camera Interfaces

Video Performance

Audio

High Speed Connectivity

I/O Interfaces

Power/Battery

Operating Environment

Form Factor

OS Support

Case Study

Lantronix Powers Next-Gen Drone OEM Innovation with Edge AI in Collaboration with Teledyne FLIR OEM & Gremsy

Empowering Your development

Services

Services

Industries

Services

Industries

Software

Industries

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