Open-Q™ 7230CS SOM (System on Module)
New

Based on Qualcomm® QCS7230 System-on-Chip

  • Develop with the smallest QCS7230 SOM module in world
  • Production ready

The Open-Q™ 7230CS production-ready computing SOM provides a power platform for edge computing:

Connect – integrated WiFi 6 & BLE 5.1 in chipset
Compute – efficient CPU, GPU, neural, and DSP engines
Control – various I/O interfaces to external systems to provide intelligent feedback

The development software package has capability to support multiple concurrent decode and encode sessions, UVC/UAC source mode for video collaboration bars to function as a USB class device, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.

The Open-Q™ 7230CS is pin-compatible with the existing Open-Q™ 8250CS and Open-Q™ 5165RB products. Lantronix offers our customers product options that enable them to scale their product line with less investment and save time.

 

 

NDAA Compliant

Open-Q™ 7230CS SOM (System on Module) Overview

Open-Q™ 7230CS Development Platform

The development kit for 7230CS SOM is composed of two separate items:

The Open-Q™ 865 Development Kit for 865XR/5165RB/7230CS (SOM not included)

Learn More Ordering Info

The Open-Q™ 7230CS SOM

Product Highlights

  • SOM with powerful specialized processing cores
  • On-device Qualcomm® AI Engine™ (7 TOPS) for machine vision, neural networks, deep learning workloads at low power
  • Powerful image signal processor supporting multiple video streaming cameras
  • Up to 8K video encode/decode, up to 64MP photo and video capture
  • WiFi 6, Bluetooth Low Energy v5.1

 

Applications

  • Video collaboration systems
  • Multi-camera and smart camera systems
  • Machine vision platforms
  • Fleet management
  • Medical imaging, connected healthcare
  • Retail self-check-out
  • Digital signage

Key Features

  • Qualcomm® 7230CS SoC
  • Up to 8GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13, Yocto Kirkstone
  • On-device AI Engine up to 7 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
  • Ultra-compact 50 x 29 mm form factor

Open-Q™ 7230CS SOM (System on Module) Tech Specs

Processor 

  • Qualcomm® 7230CS SoC built on 7nm technology:
    • Kryo™ 585 Octa-core CPU: 1 Kryo Gold prime @ 2.84 GHz + 3 Kryo Gold @ 2.42 GHz + 2 Kryo Silver @ 1.81 GHz
    • Hexagon™ 698 DSP with quad Hexagon Vector eXtensions V66Q
  • Adreno™ 650 GPU @ Fmax = 587 MHz
  • Spectra™ 480 Image Signal Processor
  • Adreno™ 665 Video Processing unit 
  • Adreno™ 995 Display Processing unit
  • NPU230 Neural Processing unit
  • SPU240 Secure Processing unit

Memory/Storage 

  • 6GB LPDDR5 @ 2750MHz, and 64GB UFS, or 8GB LPDDR5 @ 2750MHz and 128GB UFS

Wireless 

  • 802.11ax 2×2 MU-MIMO + Bluetooth 5.1, Bluetooth Milan ready

Display Interfaces

  • Up to three 4K display (1 internal display through DSI and 2 external displays through DisplayPort)
  • 2x 4-lane MIPI DSI D-PHY 1.2, up to 5040 × 2160 @ 60 fps (or 120 Hz in VR mode) + touchscreen support
  • DisplayPort v1.4 on USB Type-C, at 8.1 Gbps/lane, with USB3 and USB2 data concurrency

Camera Interfaces 

  • 3x 4-lane MIPI CSI camera ports + CCI I2C control
  • Spectra 480 ISP supporting multiple concurrent cameras

Video Performance 

  • Video decode up to 4K240/8K60. Native decode support for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2, VP8, and MPEG-2 codecs
  • Video encode up to 4K120/8K30. Native encode support for H.265 Main 10, H.265 Main, H.264 High, and VP8 codecs
  • Concurrent 4K60 Dec and 4K30 Enc

Audio

  • Supports WCD938x high fidelity audio codec and WSA881x speaker amp on carrier board
  • Dedicated Hexagon™ audio DSP, SoundWire, MI2S, DMIC, TDM/PCM interfaces for audio devices on carrier board

High Speed Connectivity 

  • 1x PCIe Gen3 2-lane
  • 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB SS data concurrency
  • 1x USB 3.1 Type-A

Operating Environment 

  • Input voltage: 3.7V nominal
  • Operating Temperature: -25°C to +85°C

Power/Battery 

  • Power management and battery charging solution on SOM

 

Form Factor 

  • 50mm x 29mm with 2x 100-pin + 1x 120-pin board to board connectors

Software

  • Android™ 13, Yocto Kirkstone

I/O Interfaces 

  • 4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to dedicated Hexagon™ sensor DSP

 

 

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Open-Q™ 7230CS SOM (System on Module) Downloads

Additional Product Information

Additional technical documentation and firmware information can be found at Tech Portal HERE

Lantronix Part # Name Description Order Now
Sorry, no parts were found that match that search query.
Lantronix Part #
QC-SOM-7230CS-A
Name
Open-Q™ 7230CS SOM (System on Module)

(6GB + 64GB)

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Lantronix Part #
QC-SOM-7230CS-B
Name
Open-Q™ 7230CS SOM (System on Module)
(8GB +128GB) Buy Now
Lantronix Part #
QC-865-DK-CARRIERBRD
Name
Open-Q™ 865 Dev Kit

(SOM not included)

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