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Open-Q™ 8750CQ μSOM (System on Module)

Based on Qualcomm® Dragonwing™ Q-8750 System-on-Chip

Ideal for Advanced Video and AI Applications

The Open-Q™ 8750CQ μSOM, powered by the Qualcomm Dragonwing™ Q-8750 processor, delivers high-performance on-device AI, advanced video processing, and multi-camera capabilities for next-generation edge devices.

Product Brief

Overview

With support for 8K/4K video, up to 12 cameras, fast interfaces, and rugged temperature operation, it is designed for demanding applications such as Enterprise Drones, Automated Guided Vehicles and Autonomous Mobile Robots, Smart Surveillance, and Video Collaboration Systems.

Lantronix offers 10+ years of product longevity, TAA/NDAA-compliant options, and strict BOM and quality controls to support reliable, long-term product deployment. With more than 20 years of hardware and software expertise and 1,200+ successful projects, Lantronix will be your long-term partner, ensuring the ongoing success of your product journey.

Key Features

Qualcomm^®Dragonwing™ Q-8750 SoC
With 77 TOPS of AI compute, the processor supports INT4/8/16 and FP16 precision
Footprint compatibility between module generations
Android™ 15* and Yocto Linux
Enhanced camera architecture with 3 ISPs supporting 6 camera interfaces, up to 5 concurrent cameras.
Multiple high speed connectivity options
Long Life – until 2035

Applications

Drones & UAVs

Video surveillance systems

Robotics / AMR

Engineering Services

Lantronix leverages our unparalleled engineering expertise and product development best practices to deliver high quality, innovative products, cost-effectively, and on time.

Learn More

Specifications

Processors
- Qualcomm Dragonwing™ Q-8750 SoC, Built on a cutting-edge 3nm process
- Max clock speed of 4.32 GHz powered by the custom 7- or 8-core Qualcomm Oryon CPU
- Adreno™ A830 : Max speed of 1.1 GHz
- Qualcomm® Hexagon™ NPU
- Up to 77 Dense TOPS; supports INT4/8/16 and FP16 precision
Memory/Storage
- 12GB LPDDR5x and 256GB UFS*
Wireless
- Supports external Wi-Fi 7 and Bluetooth 6 connectivity
Display Interfaces
- 2 x 4 lane MIPI-DSI, DP v1.4 up to 8K60
- Data rate: up to 2.5 Gbps/lane
- Supports up to UHD + (3840 x 2560) @ 144 Hz
Camera Interfaces
- Up to 6 camera interfaces; up to 5 concurrent cameras
- CSI D-PHY 4-lane, with up to 2.5 Gbps/ lane data rate
- CSI C-PHY 3-trio, with up to 13.68 Gbps/ trio
- 3 x 48 MP at 30 fps ZSL ISP
- 1 × 108 MP @ 30 fps ZSL 3 x ful ISPs + 2 x Lite ISPs
Video Performance
- Decode
  - Video decode up to 4K240/8K60. Native decode support for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2 and AV1
- Encode
  - Video encode up to 4K120/8K30. Native encode support for H.265 Main 10, H.265 Main, H.264 High
- Decode & Encode
  - Concurrent 4K60 Dec and 4K60 Enc
Audio
- SoundWire, DMICs, MI2S interface and Hi-Fi I2S
High Speed Connectivity
- 1x PCIe Gen 3 2-lane
- 1x PCIe Gen 3 2-lane 1x USB 3.1 Gen 2 @ 10 Gbps, support USB Type-C with DP
I/O Interfaces
- GPIO, UART, I2C, I3C, SPI, I2C hubs via QUP
Power/Battery
- Power management and battery charging solution on SOM
Operating Environment
- Input voltage: 3.55 – 4.4V; Typ 4V
- Operating Temperature: -30°C to +75°C
Form Factor
- 33 x 39 x 3.85 mm LGA SOM
OS Support
- Yocto Linux, Android*

* Q-8750 Chipset Performance, see SOM Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Open-Q is a trademark of Lantronix, Inc. Qualcomm and Qualcomm Dragonwing are trademarks or registered trademarks of Qualcomm Incorporated. Qualcomm Q-8750, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Spectra and Qualcomm AI Engine are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Adreno, Hexagon, Kryo and Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Resources

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Additional technical documentation and firmware information can be found at Tech Portal HERE

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