SA8295P Automotive Development Platform

Processor

Snapdragon SA8295P SIP

• Qualcomm® Kryo™ 695 CPU built on Arm v8 Cortex technology
• Qualcomm® Adreno™ 695 GPU for the highest in graphics performance and power efficiency
• Dual Qualcomm® Hexagon™ Tensor Processors integrated with Qualcomm Hexagon DSP, quad Qualcomm Hexagon Vector eXtensions (HVX) processor, and dual Qualcomm Hexagon Matrix eXtensions (HMX) coprocessors for high performance machine learning use cases
• Qualcomm Spectra™ ISP 395 image processing engine
• Adreno 665 VPU for high-quality, ultra HD video encode and decode
• Adreno DPU 1199 for ultra HD multi-display support
• Dedicated Safety Manager Subsystem equipped with dual ARC HS46 CPU in lock-step mode

Camera

• Four 4-lane MIPI CSI configurable in 4 + 4 + 4 + 4 or split 2s configuration

Display

• Three DisplayPorts, one of them shared with USB 3.1
• Four 4-lane embedded DisplayPort v1.4b
• Two 4-lane MIPI DSI D-PHY v1.2

Power Supply

• 6V to 20V. Typical 12V DC

Safety MCU

• 1x Aurix TC397xx

Memory

• Eight-channel high-speed memory – 2133 MHZ LPDDR4X SDRAM with optional low-power features (8×16-bit) 16 GB

Storage 

• Two UFS 3.1 gear 4-2 lanes for on board memory (UFS0 as booth up device)
• NVMe via PCIe (not-bootable) 

Test and Debug

• JTAG: SoC, VIP
• USB debug UARTs
• Test automation 

Connectivity

• Wi-Fi 6 (802.11ax) + Bluetooth 5.2 Dual MAC MIMO + MIMO (QCA6696)
• Dual-band dual-MAC radios for concurrent 2×2 MIMO 2.4GHz + 2×2 MIMO 5GHz operation
  Combined simultaneous maximum PHY rate of 1774Mbps
• 1x 1000 BaseT1
• 2x 100 BaseT1

Note: 1000BASE-T Ethernet PHY (U10) and port (J3) are not populated.

I/O

• 4x CAN-FD
• 2x LIN

Sensors 

• Gyro, Accelerometer – ASM330LHH
• Magnetometer – AK09917D

OS Support

• Linux Kernel v5.4, Yocto Project baseline 3.1