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Open-Q™ 8550CS SOM (System on Module)
Coming Soon!

Based on Qualcomm® QCS8550 System-on-Chip with Android™ 13 OS

Ideal for Advanced Video and AI Applications

The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on Qualcomm’s QCS8550, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.

Benefits include the ability to:

-Enhance video conferencing meeting experiences, automated guided vehicle pathing, smart camera image quality and edge AI box scalability with the family’s octal-core computing capabilities and 48 AI TOPS tensor performance.

-Perform complex 3D rendering and computer vision tasks with a powerful Adreno 740 GPU supporting ray tracing, Open GL ES, Vulkan and Open CL profiles and 4K240/8K60 video decoding and 4K120/8K30 encoding.

-Connect edge AI boxes leveraging high-speed 2.5G and 10G Ethernet ports.

Lantronix offers TAA and NDAA compliant products with at least 10 years of longevity for the Open-Q 5430CS, Open-Q 6490CS, Open-Q 5165RB, Open-Q 8250CS, and Open-Q 8550CS with strict Bill-of-Material and quality control. Combined with over 20 years of hardware design and software development experience, and 1200+ successful projects, Lantronix will be your long-term partner, ensuring the ongoing success of your product journey.

 

NDAA CompliantTAA Compliant

Open-Q™ 8550CS SOM (System on Module) Overview

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Applications

  • Multi-camera and smart camera systems
  • Edge AI gateways
  • Video collaboration
  • Video transcoding
  • Retail
  • Cloud gaming
  • Industrial drones
  • Autonomous mobile robots

Key Features

  • Qualcomm® 8550 SoC
  • Up to 8GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13 and Linux Yocto Kirkstone
  • On-device AI Engine up to 55 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options

Open-Q™ 8550CS SOM (System on Module) Tech Specs

Processor 

  • Qualcomm® 8550CS SoC built on 4nm technology:

    • Kryo™ Octa-core CPU: 1 Prime @ 3.2 GHz + 4 Gold @ 2.8 GHz + 3 Silver @ 2.0 GHz
  • Adreno™740 GPU
  • Spectra™ image signal processor
  • Adreno™ 8550 video processing unit
  • Adreno™ 1295 display processing unit
  • Dual eNPU V3, 4x HVX, HMX, 48 INT8, 12 FP16 TOPs
  • Secure processing unit

Memory/Storage 

  • 8GB LPDDR5x @ 4200MHz, and 128GB UFS, or 16GB LPDDR5x @ 4200MHz and 128GB UFS

Wireless 

  • Wi-Fi 7 802.11be 2×2 MU-MIMO + Bluetooth 5.3 capable

Display Interfaces

  • Up to four concurrent displays. Up to QHD+ @ 144Hz on-device display, up to 4K@60 Hz external display
  • 2x 4-lane MIPI DSI D-PHY 1.2
  • Support DisplayPort v1.4 on USB Type-C with USB3.2 Gen 2

Camera Interfaces 

  • 8x MIPI CSI D-PHY 1.2 or C-PHY 2.0 camera ports + CCI I2C control
  • Up to five concurrent cameras, 18bpp, 64 + 36 MP30
  • 3x 36MP or 1x 108 MP @ 30 fps ZSL, 3IFE + 2 IFE Lite
  • Always-on camera

Video Performance 

  • Video decode up to 4K240/8K60. Native decode support for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2
  • Video encode up to 4K120/8K30. Native encode support for H.265 Main 10, H.265 Main, H.264 High
  • Concurrent 4K60 Dec and 4K60 Enc

Audio

  • Supports WCD938x high fidelity audio codec and WSA884x speaker amp on carrier board
  • Dedicated Hexagon™ audio DSP, SoundWire, MI2S, DMIC interfaces for audio devices on carrier board

High Speed Connectivity 

  • 2x PCIe Gen3 2-lane
  • Support SGMII and USXGMII interfaces
  • 1x USB 3.2 Gen 2 with support for Type-C + DisplayPort v1.4
  • 1x USB 3.2 Gen 1

Operating Environment 

  • Input voltage: 3.7V nominal
  • Operating Temperature: -25°C to +85°C

Power/Battery 

  • Power management and battery charging solution on SOM

 

Form Factor 

  • 54 x 45 x 3.61 mm LGA SIP

Software

  • Android 13 and Linux Yocto Kirkstone

I/O Interfaces 

  • 2x SDC v 3.0, 1x SD, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to Qualcomm Sensing Hub 3.0

 

 

* QCS8550 Chipset Performance, see SOM Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Open-Q™ 8550CS SOM (System on Module) Downloads

Additional Product Information

Additional technical documentation and firmware information can be found at Tech Portal HERE

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8GB LPDDR5x, 128GB UFS, Wi-Fi)

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16GB LPDDR5x, 128GB UFS, Wi-Fi

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Open-Q™ 8550 SIP Android Development Kit

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Edge AI

Percepxion™ Edge AI Solution prototype’s seamless integration with the Qualcomm AI Hub, this integrated solution delivers a robust platform for optimized model performance, supporting the rapid development, deployment and acceleration of edge AI solutions.

Software

Centralized Management Software

Services

Out-of-Band Management

AI-Driven Automation and Console Access for Enterprise Networks

Software

Lantronix Centralized Management Software

Services

Resources

From training , to white papers, videos, and more, you’ll find what you need to design, develop, deploy and manage powerful, innovative remote networking and IT infrastructure management applications and solutions.

Support

Visit the Technical Resource Center for all of your support needs

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