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Snapdragon™ 670 Mobile HDK

The Snapdragon 670 Mobile Platform offers a large step up in performance for the top of the 600-tier, with the multi-core Artificial Intelligence (AI) Engine providing twice the performance of the 660 Mobile Platform. The 670 also features the premium Qualcomm Spectra™ 250 ISP, Qualcomm Hexagon™ 685 DSP, and the Qualcomm Kryo™ 360 CPU in the 600-tier for the first time, bringing speed, efficiency, and user experiences to a new level.

Snapdragon™ 670 Mobile HDK is an open-frame development kit that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, and provides developers and engineers with next generation technology and tools to accelerate software development and evaluation of Snapdragon 670 based devices.

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Snapdragon™ 670 Mobile HDK

    Overview for Snapdragon™ 670 Mobile HDK

    The Snapdragon 670 Mobile Platform offers a large step up in performance for the top of the 600-tier, with the multi-core Artificial Intelligence (AI) Engine providing twice the performance of the 660 Mobile Platform. The 670 also features the premium Qualcomm Spectra™ 250 ISP, Qualcomm Hexagon™ 685 DSP, and the Qualcomm Kryo™ 360 CPU in the 600-tier for the first time, bringing speed, efficiency, and user experiences to a new level.

    Snapdragon™ 670 Mobile HDK is an open-frame development kit that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, and provides developers and engineers with next generation technology and tools to accelerate software development and evaluation of Snapdragon 670 based devices.

      Features & Specifications for Snapdragon™ 670 Mobile HDK

      Processor

      • Qualcomm® Snapdragon™ SDA670 Octa-core 64 bit Kryo 360 CPU
        • Customized 64 bit ARM v8 compliant processor
        • 2X high-performance 2.016 GHz Kryo Gold cores
        • 6X low-power 1.708 GHz Kryo Silver cores
        • Qualcomm® Adreno™ 615 GPU with 64-bit addressing, designed for 430 MHz
        • Qualcomm® Hexagon™ 685 DSP dedicated for Computer Vision and Video Post Processing

      Accessories

      • Included LCD Display Board: 5.65′ FHD+ 2160×1080 resolution TFT with PCAP Touch panel via 4 lane MIPI DSI Interface
      • Optional Camera Board: IMX318 rear camera, IMX258 front camera, OV2281 Iris camera
      • Optional Sensor Board: Expansion board with gas, pressure, hall, UV, ALSP, magnetometer, accelerometer/gyro, humidity, temp. sensors.

      Audio

      • On-board Audio Codec (WCD9341)
      • 3.5mm headset jack
      • Audio input/output expansion headers

      Video

      • Encode: 4K30 8-bit: H.264/VP8/HEVC
      • Decode: 4K30 8-bit: H.264/HEVC/VP9 or 4K30 10-bit: HEVC/VP9
      • Concurrent: 4K30 Decode + 1080p30 Encode

      Wireless

      • Qualcomm® Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2X2 MIMO (WCN3990) with MH4L antenna conn. and PCB antenna
      • Bluetooth 5.x + BLE

      Graphics

      • Qualcomm® Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2X2 MIMO (WCN3990) with MH4L antenna conn. and PCB antenna
      • Bluetooth 5.x + BLE

      Display Interfaces

      • MIPI DSI connector with 1x 4-lane DSI port + Touch for included LCD panel accessory
      • HDMI Video output via DSI -> HDMI bridge chip on dev kit
      • VESA DisplayPort V1.3 on USB Type-C interface

      Camera interfaces

      • 3x 4-lane MIPI CSI interfaces on single camera connector
      • Qualcomm® Spectra™ ISP: Dual 14-bit + single Lite ISP: 16 +16 + 2 MP or 25MP 30fps
      • 25MP30 ZSL with dual ISP; 16 MP 30 ZSL with a single ISP

      USB

      • 1x USB3.1
      • Type C with VESA DisplayPort V1.3
      • 1x USB micro-B serial UART

      I/O

      • uSD card socket
      • NFC expansion header
      • Sensor expansion header
      • I2C, SPI, GPIO, UART

      Power Input

      • Qualcomm® Power and battery management (PM670 + PM670L + SMB1355)

      Location

      • Qualcomm® SDR660 GNSS receiver with GPS/GLONASS/COMPASS/Galileo
      • PCB antenna and SMA connector option

      Size

      • Mini-ITX form-factor — 170mm x 170mm

      Memory/Storage

      • 6GB LPDDR4x RAM
      • 64GB eMMC 5.1 Flash Storage (non-PoP memory)

      Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

      Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

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