Open-Q™ 5430CS SiP (System in Package)
Coming Soon!

Based on Qualcomm® QCS6490 System-on-Chip with Android™ 13 OS

The Open-Q 5430CS provide flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as video telematics, video collaboration, industrial handhelds, and AI cameras. The Open-Q 5430CS is based on Qualcomm’s QCS5430 chipset. The customers can select between pre-set feature packs according to your product needs today or wait and easily upgrade over the air (OTA) in the future via software to unlock even greater performance.

With the release of the pin-compatible Open-Q 5430CS and Open-Q 6490CS, Lantronix offers our customers product choices that allow them to scale their product line with less investment and save time.

Lantronix offers at least 10 years of longevity for the Open-Q 5430CS, Open-Q 6490CS, Open-Q 5165RB, Open-Q 8250CS, and Open-Q 8550CS with strict Bill-of-Material and quality control. Combined with over 20 years of hardware design and software development experience, and 1200+ successful projects, Lantronix will be your long-term partner, ensuring the ongoing success of your product journey.

 

NDAA CompliantTAA Compliant

Open-Q™ 5430CS SiP (System in Package) Overview

Be the First to Know – Sign Up for Exclusive Launch Updates!

Applications

  • IP Cameras
  • Multi-camera and smart camera systems
  • Drones
  • Video telematics
  • Video conferencing
  • Retail self-check-out
  • Digital signage

Key Features

  • Qualcomm® QCS5430 SoC
  • FP2.5 – Up to 4GB LPDDR5 RAM + 32GB eMMC
  • Support UFS and NMVe storage
  • Android™ 13
  • FP1 – On-device AI Engine up to 3.5 TOPS
  • FP2.5 – On-device AI Engine up to 6 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options

Open-Q™ 5430CS SiP (System in Package) Tech Specs

Processor 

  • Qualcomm® QCS5430 SoC built on 6nm technology:
    • FP1: Kryo™ 670 Hexa-core CPU: 2 Gold @ 2.1 GHz + 4 Silver @ 1.8 GHz
    • FP2.5: Kryo™ 670 Octa-core CPU: 1 Prime @2.4GHz + 3 Gold @ 2.4 GHz + 4 Silver @ 1.8 GHz
  • Hexagon™ 770 with Hexagon Vector eXtensions (HVX)
  • Adreno™ 643L GPU @ Fmax Spectra™
  • Spectra™ 570L ISP
  • Adreno™ 633 video processing unit
  • Adreno™ 1075 display processing unit
  • 6th Gen Qualcomm AI engine
  • Secure processing unit

Memory/Storage 

  • 4GB LPDDR5 @ 3200MHz, and 16GB (FP1) or 32GB (FP2.5) eMMC; Supports external UFS and NVMe storages

Wireless 

  • Supports external Wi-Fi via PCIe 1-lane, up to Wi-Fi 6E, 2×2 MU-MIMO + Bluetooth 5.2

Display Interfaces

  • 1x 4-lane MIPI DSI D-PHY 1.2, up to FHD+ touchscreen support
  • Support for USB3.1 Type-C with DisplayPort v1.4 and USB 2.0

Camera Interfaces 

  • 4x 4-lane MIPI CSI D-PHY 1.2 or C-PHY 1.2 with CCI I2C control
  • Spectra 570L ISP supporting 36 MP + 22 MP at 30 fps, 2x IFE, 2x IFE-lite, 4 concurrent
    MIPI CSI configurable in 4 + 4 + 4 + 4 configuration

Video Performance 

  • Video decode up to 4K60. Native decode for H.265/H.265/VP9
  • Video encode up to 4K30. Native encode for H.265/H.265; Support for HDR10 and HDR10+ playback
  • Concurrent 1080K60 Decode and 1080K60 Encode or 4K30 Decode and 4K30 Encode

Audio

  • Support interfaces to WCD938x/WCD937x high fidelity audio codec and WSA883x speaker amp on carrier board.
  • Hexagon™ audio DSP V66M

High Speed Connectivity 

  • 1x PCIe Gen3 2-lane; 1x PCIe Gen3 1-lane for connectivity
  • 1x USB 3.1 with support for Type-C + DisplayPort v1.4 with USB SS data concurrency
  • 1x USB 2.0

Operating Environment 

  • Input voltage: 3.8V nominal
  • Operating Temperature: Commercial and industrial temperatures available.

Power/Battery 

  • Power management on SOM

 

Form Factor 

  • 47 x 35 x 2.72 mm LGA

Software

  • Android™ 13 

I/O Interfaces 

  • 4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to dedicated Hexagon™ sensor DSP

 

 


*QCS5430 Chipset Performance, see SOM/SIP Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Open-Q™ 5430CS SiP (System in Package) Downloads

Additional Product Information

Additional technical documentation and firmware information can be found at Tech Portal HERE

Lantronix Part # Name Description Order Now
Sorry, no parts were found that match that search query.
Lantronix Part #
QC-SIP-5430CS-A
Name

Open-Q 5430 FP1, 4GB LPDDR5, 16GB eMMC

Contact Us
Lantronix Part #
QC-SIP-5430CS-B
Name

Open-Q 5430 FP2.5, 4GB LPDDR5, 32GB eMMC

Contact Us
Lantronix Part #
QC-DK-5430-LA
Name

Open-Q 54300 development kit bundle; Main board, 1xIMX577 camera, 1x OV9282 camera, power supply, andUSB debug cable. Android OS

Contact Us

Lantronix's Full Solution & Service Offering

Engineering Services Logo
Engineering Services
Lantronix leverages our unparalleled engineering expertise and product development best practices to deliver high quality, innovative products, cost-effectively, and on time.
Percepxion
The Percepxion™ IoT Device Management platform provides comprehensive device life cycle management, application integration and data analytics,​ so you can focus on your business.
LEVEL, Technical Services
Our dedicated technical experts are here to assist with your unique IoT and IT solutions.
scroll to top

By continuing to use the site, you agree to the use of cookies. more information

The cookie settings on this website are set to "allow cookies" to give you the best browsing experience possible. If you continue to use this website without changing your cookie settings or you click "Accept" below then you are consenting to this.

Close