Industrial-grade high performance Wi-Fi, Bluetooth, and Ethernet connectivity with enterprise security

Connectivity:

Bluetooth, Ethernet, Wi-Fi

Family:

xPico

Industrial-grade high performance Wi-Fi, Bluetooth, and Ethernet connectivity with enterprise security

Connectivity:

Bluetooth, Ethernet, Wi-Fi

Family:

xPico

Secure, Industrial-grade 802.11ac Wi-Fi, Bluetooth, and Ethernet connectivity

Connectivity:

Bluetooth, Ethernet, Wi-Fi

Family:

xPico

The CCARD provides a near commercial-grade Telematics Control Unit (TCU) that provides high-speed (1Gbps) wide area networking (WAN) connectivity from an automobile.

Connectivity:

Bluetooth, Cellular, Ethernet, Wi-Fi

The C-V2X Development Platform is intended for system testing and demonstration of V2V/V2I/V2P (vehicle to vehicle, vehicle to infrastructure, vehicle to pedestrian) and V2N (vehicle to network) functionalities. The V2N functionality is provided by the companion CCARD Platform (telematics control unit).

Connectivity:

Bluetooth, Cellular, Ethernet, Wi-Fi

Powered by the Open-Q™ 800 SOM (System on Module)
Quad-core Krait™, Adreno™ 330 GPU, Hexagon™ QDSP6
Carrier board 170mm X 170mm, SOM 82mm x 42mm
Android™ 4 Jelly Bean

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 810 SOM (System on Module)
Octa-core ARM® Cortex® quad A57, quad A53,Adreno™ 430 GPU, Hexagon™ v5.5 DSP
Carrier board 170mm X 170mm, SOM 82mm x 42mm
Android™ 6 Marshmallow

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 2100 SOM (System on Module)
Quad-core ARM Cortex A7 up to 1.094GHz
Carrier board nano-ITX 120mm x 120mm, SOM 31.5mm x 15mm
Android™ 7 Customized for Wearable products

Connectivity:

Bluetooth, Wi-Fi

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ Wear 2100 processor
Quad-Core ARM Cortex A7 CPU, Adreno™ 304 GPU
Dimensions 15mm x 31.5mm
Android™ 7 Customized for Wearable products

Connectivity:

Bluetooth, Wi-Fi

Qualcomm® Snapdragon™ 212 (APQ8009)
Up to 8MP over 2-lane MIPI CSI
Wi-Fi 802.11b/g/n 2.4Ghz with chip antenna and U.FL connector
Qualcomm™ Fluence™ HD with Noise Cancellation

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 212A SOM (System on Module)
Home Hub and Smart Audio Dev Platform
Carrier board 170mm x 115mm
Linux Home Hub OS

Connectivity:

Bluetooth, Wi-Fi

Production-ready, Pre-certified, SOM (System on Module) based on the Qualcomm® Snapdragon™ 212 processor
Quad-Core ARM Cortex A7 1.267GHz, Adreno™ 304 GPU, QDSP6 DSP
Dimensions  46.5mm x 50mm
Linux Home Hub OS

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 2500 SOM (System on Module)
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Carrier board 170mm x 170mm,SOM 31.5mm x 15mm
Optimized Android™ for Wearables

Connectivity:

Bluetooth, Wi-Fi

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 2500 processor
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Dimensions 15mm x 31.5mm
Android™ 8 Oreo™ for Wearables

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 410 SOM (System on Module)
Quad-core 64-bit ARM® Cortex® A53, Adreno™ 306 GPU, Hexagon™ v5 DSP
Carrier board 130mm X 130mm, SOM 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Windows™ 10 IoT Core, Linux®

Connectivity:

Bluetooth, Wi-Fi

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 410 processor
Quad-core 64-bit ARM® Cortex®, Adreno™ 306 GPU & Hexagon™ v5 DSP
Dimensions 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Windows 10 IoT Core, Linux®

Connectivity:

Bluetooth, Wi-Fi

Production-ready SBC based on the Qualcomm® QCS605 System-on-Chip
Octa-core Kryo™ 300 CPU, Adreno™ 615 GPU, Hexagon™ 685 DSP
50 x 68 mm product-ready form factor
Android™ 9 with Qualcomm® Vision Intelligence Platform

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 624A SOM (System on Module)
Octa-Core 64-bit ARM® Cortex™ A53 1.8GHz
Carrier board 170mm x 115mm
Android™ 8 Oreo™

Connectivity:

Bluetooth, Wi-Fi

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 624 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 46.5mm x 50mm
Android™ 8 Oreo™

Connectivity:

Bluetooth, Wi-Fi

Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 626 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 25mm x 50mm
Android™ 9, Android™ 10,  Yocto Linux®

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 626 µSOM (Micro System on Module)
Octa-Core 64-bit ARM® Cortex™ A53 2.2GHz CPU (APQ 8053Pro)
Carrier board 170mm x 170mm
Android™ 9, Android™ 10,  Yocto Linux®

Connectivity:

Bluetooth, Wi-Fi

Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 660 processor
Octa-core 64-bit Kryo™ 260 CPU, Adreno™ 512 GPU & Hexagon™ 680 DSP
Dimensions 25mm x 50mm
Android™ 9 Pie

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 660 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 260 CPU, Adreno™ 512 GPU & Hexagon™ 680 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 820 SOM (System on Module)
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 82mm x 42mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux®, Android™ 9 Pie
See the Open-Q™ 820 SOM vs. Open-Q™ 820 µSOM selection guide here

Connectivity:

Bluetooth, Wi-Fi

Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 820 processor
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Dimensions 42mm x 82mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux, Android™ 9 Pie

Connectivity:

Bluetooth, Wi-Fi

Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 820 processor
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Dimensions 25mm x 50mm
Android™ 7 Nougat, Android™ 8 Oreo™ , Linux®, Android™ 9 Pie

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 820 µSOM (Micro System on Module)
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux®, Android™ 9 Pie
See the Open-Q™ 820 SOM vs. Open-Q™ 820 µSOM selection guide here

Connectivity:

Bluetooth, Wi-Fi

Production-ready µSOM based on long-life, higher-speed, Qualcomm® Snapdragon™ 820E (APQ8096SG) SoC
Quad-core 64-bit Kryo™ CPU @ 2.342 GHz, Adreno™ 530 GPU @ 652.8 MHz, Hexagon™ 680 DSP with HVX
Dimensions 25mm x 50mm
Android™ 9 Pie, Linux®

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 820Pro µSOM (Micro System on Module)
Long-life, higher-speed, Qualcomm® Snapdragon™ 820E (APQ8096SG) SoC
Quad-core 64-bit Kryo™ CPU @ 2.342 GHz, Adreno™ 530 GPU @ 652.8 MHz, Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 9 Pie, Debian Linux®

Connectivity:

Bluetooth, Wi-Fi

Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 835 processor
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with dual HVX
Dimensions 25mm x 50mm
Android™ 8 Oreo™, Android™ 9 Pie

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 835 µSOM (Micro System on Module).
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with Dual HVX
Carrier board Mini-ITX 170mm x 170mm
Android™ 8 Oreo™, Android™ 9 Pie

Connectivity:

Bluetooth, Wi-Fi

- Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 845 processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP with dual HVX51
- Dimensions 25mm x 50mm
- Android™ 9 Pie, Yocto Linux®

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-Q™ 845 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie, Yocto Linux®

Connectivity:

Bluetooth, Wi-Fi

Powered by the Open-X™ 8M SOM (System on Module)
NXP® i.MX 8M Quad-Core ARM® Cortex® A53 + single-core Cortex® M4F
Carrier board 170mm x 170mm, SOM 55mm x 35mm
Android™ 8 Oreo™, Linux®

Connectivity:

Bluetooth, Wi-Fi

Production-ready SOM (System on Module) based on the NXP® i.MX 8M processor
Quad-Core ARM® Cortex® A53 + single-core Cortex® M4F
Dimensions 35mm x 55mm
Android™ 8 Oreo™ , Linux®

Connectivity:

Bluetooth, Wi-Fi

Drone and Robotics research and development
Consumer Drone products
Aerial Robotics
Land Robotics
Embedded vision and navigation applications

Connectivity:

Bluetooth, Wi-Fi

Connectivity:

Bluetooth, Cellular, Wi-Fi

Connectivity:

Bluetooth, Cellular, Wi-Fi

Connectivity:

Bluetooth, Cellular, Ethernet

Connectivity:

Bluetooth, Ethernet, Wi-Fi

Connectivity:

Bluetooth, Ethernet, Wi-Fi

Powered by the Qualcomm® Snapdragon™ 670 Processor
Octa-core 64-bit Kryo™ 360 CPU, Adreno™ 615 GPU & Hexagon™ 685 DSP
Mini-ITX form-factor — 170mm x 170mm
Android™ 8 Oreo™

Connectivity:

Bluetooth, Wi-Fi

- Powered by the Qualcomm® Snapdragon™ 845 Processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
- Mini-ITX form-factor — 170mm x 170mm
- Android™ 9 Pie

Connectivity:

Bluetooth, Wi-Fi

Powered by the Qualcomm® Snapdragon™ 8150 Processor
Octa-core 64-bit Kryo™ 485 CPU, Adreno™ 640 GPU & Hexagon™ 690 DSP
Main Board: 100 mm x 85 mm
Android™ 9, Android™ 10

Connectivity:

Bluetooth, Wi-Fi

Powered by the Qualcomm® Snapdragon™ SM8250 Processor
Octa-core 64-bit Kryo™ 585 CPU, Adreno™ 650 GPU & Hexagon™ 698 DSP
Main Board: 100 mm x 85 mm
Android™ 10

Connectivity:

Bluetooth, Wi-Fi

- Production-ready SOM (System on Module) based on the Qualcomm® QCS610 SoC
- Kryo™ 460 Octa-core CPU, Adreno™ 612 GPU, Hexagon™ DSP
- Dimensions 50mm x 25mm
- Yocto Linux connected camera SDK

Connectivity:

Bluetooth, Wi-Fi

- Production-ready SOM based on the powerful Qualcomm® SXR2130P
- Qualcomm® SXR2130P SoC built on 7nm technology
- Dimensions: 50mm x 29mm
- Android™ 10

Connectivity:

Bluetooth, Wi-Fi