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xPico 200 Series
Industrial-grade high performance Wi-Fi, Bluetooth, and Ethernet connectivity with enterprise security
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xPico 240 Embedded IoT Gateway
Industrial-grade high performance Wi-Fi and Ethernet connectivity with enterprise security
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xPico 250 Embedded IoT Gateway
Industrial-grade high performance Wi-Fi, Bluetooth, and Ethernet connectivity with enterprise security
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xPico 270 Embedded IoT Gateway
Secure, Industrial-grade 802.11ac Wi-Fi, Bluetooth, and Ethernet connectivity
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Industrial-grade, reliable 5G (802.11ac) Enterprise Wi-Fi connectivitywill full Linux based development environment
Connectivity:
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Linux based Wi-Fi® System On Module
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The PremierWave Development Kit is designed to deliver a new dimension of Wi-Fi networking.
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Industrial grade Wi-Fi module
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Products
The CCARD provides a near commercial-grade Telematics Control Unit (TCU) that provides high-speed (1Gbps) wide area networking (WAN) connectivity from an automobile.
The C-V2X Development Platform is intended for system testing and demonstration of V2V/V2I/V2P (vehicle to vehicle, vehicle to infrastructure, vehicle to pedestrian) and V2N (vehicle to network) functionalities. The V2N functionality is provided by the companion CCARD Platform (telematics control unit).
Powered by the Open-Q™ 800 SOM (System on Module)
Quad-core Krait™, Adreno™ 330 GPU, Hexagon™ QDSP6
Carrier board 170mm X 170mm, SOM 82mm x 42mm
Android™ 4 Jelly Bean
Powered by the Open-Q™ 810 SOM (System on Module)
Octa-core ARM® Cortex® quad A57, quad A53,Adreno™ 430 GPU, Hexagon™ v5.5 DSP
Carrier board 170mm X 170mm, SOM 82mm x 42mm
Android™ 6 Marshmallow
Powered by the Open-Q™ 2100 SOM (System on Module)
Quad-core ARM Cortex A7 up to 1.094GHz
Carrier board nano-ITX 120mm x 120mm, SOM 31.5mm x 15mm
Android™ 7 Customized for Wearable products
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ Wear 2100 processor
Quad-Core ARM Cortex A7 CPU, Adreno™ 304 GPU
Dimensions 15mm x 31.5mm
Android™ 7 Customized for Wearable products
Qualcomm® Snapdragon™ 212 (APQ8009)
Up to 8MP over 2-lane MIPI CSI
Wi-Fi 802.11b/g/n 2.4Ghz with chip antenna and U.FL connector
Qualcomm™ Fluence™ HD with Noise Cancellation
Powered by the Open-Q™ 212A SOM (System on Module)
Home Hub and Smart Audio Dev Platform
Carrier board 170mm x 115mm
Linux Home Hub OS
Production-ready, Pre-certified, SOM (System on Module) based on the Qualcomm® Snapdragon™ 212 processor
Quad-Core ARM Cortex A7 1.267GHz, Adreno™ 304 GPU, QDSP6 DSP
Dimensions 46.5mm x 50mm
Linux Home Hub OS
Powered by the Open-Q™ 2500 SOM (System on Module)
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Carrier board 170mm x 170mm,SOM 31.5mm x 15mm
Optimized Android™ for Wearables
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 2500 processor
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Dimensions 15mm x 31.5mm
Android™ 8 Oreo™ for Wearables
Powered by the Open-Q™ 410 SOM (System on Module)
Quad-core 64-bit ARM® Cortex® A53, Adreno™ 306 GPU, Hexagon™ v5 DSP
Carrier board 130mm X 130mm, SOM 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Windows™ 10 IoT Core, Linux®
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 410 processor
Quad-core 64-bit ARM® Cortex®, Adreno™ 306 GPU & Hexagon™ v5 DSP
Dimensions 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Windows 10 IoT Core, Linux®
Production-ready SBC based on the Qualcomm® QCS605 System-on-Chip
Octa-core Kryo™ 300 CPU, Adreno™ 615 GPU, Hexagon™ 685 DSP
50 x 68 mm product-ready form factor
Android™ 9 with Qualcomm® Vision Intelligence Platform
Powered by the Open-Q™ 624A SOM (System on Module)
Octa-Core 64-bit ARM® Cortex™ A53 1.8GHz
Carrier board 170mm x 115mm
Android™ 8 Oreo™
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 624 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 46.5mm x 50mm
Android™ 8 Oreo™
Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 626 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 25mm x 50mm
Android™ 9, Android™ 10, Yocto Linux®
Powered by the Open-Q™ 626 µSOM (Micro System on Module)
Octa-Core 64-bit ARM® Cortex™ A53 2.2GHz CPU (APQ 8053Pro)
Carrier board 170mm x 170mm
Android™ 9, Android™ 10, Yocto Linux®
Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 660 processor
Octa-core 64-bit Kryo™ 260 CPU, Adreno™ 512 GPU & Hexagon™ 680 DSP
Dimensions 25mm x 50mm
Android™ 9 Pie
Powered by the Open-Q™ 660 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 260 CPU, Adreno™ 512 GPU & Hexagon™ 680 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie
Powered by the Open-Q™ 820 SOM (System on Module)
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 82mm x 42mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux®, Android™ 9 Pie
See the Open-Q™ 820 SOM vs. Open-Q™ 820 µSOM selection guide here
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 820 processor
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Dimensions 42mm x 82mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux, Android™ 9 Pie
Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 820 processor
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Dimensions 25mm x 50mm
Android™ 7 Nougat, Android™ 8 Oreo™ , Linux®, Android™ 9 Pie
Powered by the Open-Q™ 820 µSOM (Micro System on Module)
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux®, Android™ 9 Pie
See the Open-Q™ 820 SOM vs. Open-Q™ 820 µSOM selection guide here
Production-ready µSOM based on long-life, higher-speed, Qualcomm® Snapdragon™ 820E (APQ8096SG) SoC
Quad-core 64-bit Kryo™ CPU @ 2.342 GHz, Adreno™ 530 GPU @ 652.8 MHz, Hexagon™ 680 DSP with HVX
Dimensions 25mm x 50mm
Android™ 9 Pie, Linux®
Powered by the Open-Q™ 820Pro µSOM (Micro System on Module)
Long-life, higher-speed, Qualcomm® Snapdragon™ 820E (APQ8096SG) SoC
Quad-core 64-bit Kryo™ CPU @ 2.342 GHz, Adreno™ 530 GPU @ 652.8 MHz, Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 9 Pie, Debian Linux®
Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 835 processor
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with dual HVX
Dimensions 25mm x 50mm
Android™ 8 Oreo™, Android™ 9 Pie
Powered by the Open-Q™ 835 µSOM (Micro System on Module).
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with Dual HVX
Carrier board Mini-ITX 170mm x 170mm
Android™ 8 Oreo™, Android™ 9 Pie
- Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 845 processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP with dual HVX51
- Dimensions 25mm x 50mm
- Android™ 9 Pie, Yocto Linux®
Powered by the Open-Q™ 845 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie, Yocto Linux®
Powered by the Open-X™ 8M SOM (System on Module)
NXP® i.MX 8M Quad-Core ARM® Cortex® A53 + single-core Cortex® M4F
Carrier board 170mm x 170mm, SOM 55mm x 35mm
Android™ 8 Oreo™, Linux®
Production-ready SOM (System on Module) based on the NXP® i.MX 8M processor
Quad-Core ARM® Cortex® A53 + single-core Cortex® M4F
Dimensions 35mm x 55mm
Android™ 8 Oreo™ , Linux®
Drone and Robotics research and development
Consumer Drone products
Aerial Robotics
Land Robotics
Embedded vision and navigation applications
Powered by the Qualcomm® Snapdragon™ 670 Processor
Octa-core 64-bit Kryo™ 360 CPU, Adreno™ 615 GPU & Hexagon™ 685 DSP
Mini-ITX form-factor — 170mm x 170mm
Android™ 8 Oreo™
- Powered by the Qualcomm® Snapdragon™ 845 Processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
- Mini-ITX form-factor — 170mm x 170mm
- Android™ 9 Pie
Powered by the Qualcomm® Snapdragon™ 8150 Processor
Octa-core 64-bit Kryo™ 485 CPU, Adreno™ 640 GPU & Hexagon™ 690 DSP
Main Board: 100 mm x 85 mm
Android™ 9, Android™ 10
Powered by the Qualcomm® Snapdragon™ SM8250 Processor
Octa-core 64-bit Kryo™ 585 CPU, Adreno™ 650 GPU & Hexagon™ 698 DSP
Main Board: 100 mm x 85 mm
Android™ 10
xPico Wi-Fi Tower Module for Freescale Tower System w/xPico Wi-Fi Module (Freescale Tower System not included)
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